Flexible Back Plate Bent Electrode for Borderless Micro LED Bonding
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Solution Overview
Problem
Existing micro light-emitting diode display technologies face challenges in achieving a back plate with a narrow or borderless design, which is necessary for large-size splicing, as the back plate cannot be effectively bonded to a display substrate without exposing bonding electrodes, leading to defects and increased complexity.
Innovation Solution
A flexible back plate with a bonding electrode is bent to form a bent portion, allowing the electrode to be located underneath the display substrate, eliminating the need for a border and reducing defects by using a post spacer and conductive paste for electrical connection, while a heat-resistant adhesive layer ensures secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the back plate is made with a narrow border or without a border to enable large-size splicing, then the display area and integration are improved, but the bonding electrode cannot be properly bonded to the display substrate, leading to manufacturing defects
Solution Approach 1:
The bonding electrode is bent along a bending line to form a bent portion that extends in a direction away from the display substrate. This dimensional change allows the bonding electrode to be positioned underneath the display substrate without requiring a border, enabling both large display area and reliable bonding simultaneously
Solution Approach 2:
The bonding electrode is pre-formed with a bent portion before bonding to the display substrate. This preliminary shaping ensures that when the bonding electrode is attached, its distal end naturally extends underneath the display substrate, providing reliable bonding contact without requiring post-bonding adjustments or border structures
2Ease of manufacture
If the bonding electrode is exposed on the back plate surface for bonding, then the bonding process is simplified, but the display substrate cannot be fully covered, requiring a border that increases device complexity
Solution Approach 1:
Instead of keeping the bonding electrode flat on the back plate surface, the electrode is bent to extend in a direction away from the display substrate. This allows the electrode to be positioned underneath the display substrate, eliminating the need for a border while maintaining bonding accessibility
Solution Approach 2:
Rather than having the bonding electrode extend outward from the back plate surface for bonding, the electrode is configured to extend underneath the display substrate. This inverted arrangement simplifies the back plate structure by eliminating borders while still enabling bonding operations
3Shape
If the flexible back plate is bent to position the bonding electrode underneath the display substrate, then a borderless design is achieved, but the bonding electrode must withstand thermal expansion and mechanical stress
Solution Approach 1:
The bonding electrode is formed on a flexible back plate that can be bent without breaking. The flexibility of the back plate allows it to accommodate thermal expansion and mechanical stress while maintaining the bent configuration that positions the bonding electrode underneath the display substrate
Solution Approach 2:
The bonding electrode is designed with a bent portion that changes its spatial configuration. This bent structure distributes mechanical stress and accommodates thermal expansion differently than a flat electrode would, improving durability while maintaining the borderless design
Data Source
AI summary
Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.