Flexible Bridge Die Stack Package for Wearable IoT Devices
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Solution Overview
Problem
Current semiconductor package technologies fail to provide flexible and high-capacity solutions for wearable devices and high-performance electronic products, as they lack the ability to bend or warp without cracking, which is essential for IoT applications.
Innovation Solution
A stack package design featuring flexible substrates, sub-packages, and a flexible bridge die that allows for vertical stacking and bending without cracking, utilizing polyimide materials and polymeric encapsulating layers to maintain flexibility and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional semiconductor package structures are used, then manufacturing and electrical connectivity are maintained, but the package cannot bend or warp without cracking, limiting flexibility applications
Solution Approach 1:
The patent applies flexible substrates (first and second flexible substrates) and flexible bridge dies that can bend and warp without cracking. These flexible components replace conventional rigid package structures, enabling the entire semiconductor package to be flexible while maintaining structural integrity and electrical connectivity through the flexible interconnects and encapsulating layers
Solution Approach 2:
The patent uses polyimide materials and polymeric encapsulating layers as composite flexible materials that provide both flexibility and mechanical strength. The outer polymeric encapsulating layer fills spaces and encapsulates sub-packages, while the polyimide flexible substrates and bridge dies provide structural support with inherent flexibility, creating a composite structure that resists cracking during bending
2Quantity of substance
If multiple semiconductor dies are stacked to increase storage capacity, then high-performance applications are enabled, but the complex structure becomes difficult to manufacture with precise alignment
Solution Approach 1:
The patent divides the multi-die stack into modular sub-packages (first sub-package, second sub-package), each containing semiconductor dies and flexible bridge dies. This segmentation allows each sub-package to be manufactured and aligned independently, then stacked together using the flexible substrates as alignment references, simplifying the overall manufacturing process while maintaining high storage capacity
Solution Approach 2:
The flexible bridge dies and polymeric encapsulating layers serve as intermediaries between the semiconductor dies and flexible substrates. These intermediary components facilitate precise alignment and electrical connectivity during stacking, enabling high-capacity multi-die configurations while maintaining ease of manufacture through standardized interconnection interfaces
3Adaptability or versatility
If flexible materials are used to enable bending, then adaptability for wearable devices is achieved, but structural strength and electrical integrity may be compromised
Solution Approach 1:
The patent employs polyimide flexible substrates and polymeric encapsulating layers as composite materials that combine flexibility with structural strength. The polyimide material provides inherent flexibility for bending while maintaining mechanical strength, and the outer polymeric encapsulating layer protects the internal structures, ensuring both adaptability and structural integrity are achieved simultaneously
Solution Approach 2:
The flexible substrates and encapsulating layers act as flexible shells that enclose and protect the semiconductor components. These thin film structures provide the necessary flexibility for bending and warping while maintaining structural integrity through their continuous, encapsulating nature, preventing damage to internal components during flexing
Data Source
AI summary
A stack package includes a first sub-package, a second sub-package stacked on the first sub-package. The first sub-package is configured to include first and second semiconductor dies, a first flexible bridge die disposed between the first and second semiconductor dies.