Flexible Circuit Board Adhesion for Display Peel-Off Prevention
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Solution Overview
Problem
The peel-off phenomenon occurs in tape carrier packages (TCP) or chip on film (COF) packages due to a restoring force acting opposite to the curved direction, leading to detachment from the display panel over time.
Innovation Solution
A display apparatus with a flexible printed circuit board firmly fixed to the display panel using a panel adhesive film and an FPCB adhesive film, where the FPCB adhesive film overlaps the non-bonding area, and a cover panel with a porous material is used to absorb shocks, ensuring strong adhesion and preventing peel-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the COF package is curved to be mounted on the lower portion of the display panel, then it achieves flexible mounting and electrical connection, but a restoring force acts opposite to the curved direction causing peel-off phenomenon over time
Solution Approach 1:
The patent applies preliminary anti-action by introducing a counteracting force through the adhesive film and cover panel structure before the peel-off phenomenon can occur. The adhesive film is specifically designed to provide bonding force that opposes the restoring force of the curved COF package, preventing detachment in advance rather than reacting after peeling occurs.
Solution Approach 2:
The patent employs composite materials by combining the COF package with an adhesive film and cover panel to create a composite structure. This composite structure integrates the flexible mounting capability of the COF package with the bonding strength of the adhesive film and the protective properties of the cover panel, achieving both flexibility and peel-off resistance.
2Reliability
If the flexible printed circuit board is firmly fixed to the display panel using adhesive films, then adhesion force increases and peel-off is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges multiple functions into the cover panel structure. The cover panel serves both as a protective element and as a substrate for the adhesive film, while also providing mechanical support for the curved COF package. This integration reduces the number of separate components and simplifies the overall manufacturing process despite the enhanced adhesion requirements.
3Object-affected harmful factors
If a cover panel with porous material is used to absorb shocks, then protection against external shock is improved, but the material selection and manufacturing precision requirements increase
Solution Approach 1:
The patent directly applies porous materials in the cover panel to provide shock absorption functionality. The porous structure allows the material to deform and absorb impact energy while maintaining structural integrity. This approach provides effective shock protection without requiring complex manufacturing processes, as the porous structure can be achieved through standard material selection and forming techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents or minimizes the peel-off phenomenon by increasing adhesion force over time, ensuring a stable connection between the flexible printed circuit board and the display panel, enhancing the durability and reliability of the display apparatus.
Implementation Method 1
a panel adhesive film on the display panel... the flexible printed circuit board includes: a base film having a bonding area that is bonded to the display panel and the main printed circuit board... an FPCB adhesive film on the base film... the FPCB adhesive film and the panel adhesive film being adhered to each other in the assembled state
Implementation Method 2
the cover panel may include a porous material... to protect the display panel from an external shock
Data Source
AI summary
A display apparatus includes a display panel, a panel adhesive film on the display panel, a main printed circuit board, and a flexible printed circuit board. The main printed circuit board is adhered to the panel adhesive film in an assembled state. The flexible printed circuit board electrically connects the display panel to the main printed circuit board. The flexible printed circuit board includes a base film, an integrated circuit chip, and a FPCB adhesive film. The base film has a bonding area that is bonded to the display panel and the main printed circuit board and a non-bonding area that is not bonded to the display panel and the main printed circuit board. The FPCB adhesive film is on the base film and overlaps with the non-bonding area. The FPCB adhesive film and the panel adhesive film are adhered to each other in the assembled state.