Circuit Bendability/Stretchability TRIZ Cases

Foldable frames with flex circuits reduce manufacturing costs while maintaining high-speed chip-to-chip communication.

A polyester resin film polymerized with 1,4-cyclohexanedimethanol and aromatic dicarboxylic acid prevents dimensional instability caused by moisture absorption.

A camera module holder frame stabilizes lens units to reduce assembly tolerances and improve image quality.

A three-dimensional elastic circuit uses orthogonal patterns to stretch along x, y, and z axes.

A multilayer resin substrate positions conductor patterns inside the stacked body at bent portions to reduce mechanical stress.

A movable optical unit uses a guide groove to route flexible circuits away from rotating housing surfaces.

A printed circuit bonded to a buckled synthetic polymer membrane maintains electrical conductivity during stretching.

A stretchable device uses a cover layer to shield organic wiring components from direct skin contact.

Varying the shielding layer opening ratio reduces radiated noise while maintaining flexibility and high-frequency signal transmission characteristics.

Thermoforming conductive ink on elastomeric substrates creates buckled traces that maintain constant electrical resistance during stretching.

Vent holes and slits allow extensible wiring to stretch without resistance spikes, maintaining conductivity during repeated cycles.

A gap compensation layer with a curvature-dependent thickness prevents peeling and wrinkles in multi-layered in-mold electronic devices.

Hollow stretchable portions in the connecting beam distribute stress during bending, preventing substrate fractures while maintaining structural integrity.

Threaded recesses in interposers secure conductive strands to bond pads, preventing dislodgement when fabric bends or stretches.

Segmented conductive paste on an elastomer base maintains stable resistance during extension.

A flexible printed circuit board merges its conductive copper layer with the screw fastening area to create a single structural unit.

A flexible circuit board layer inverts within a rigid substrate to fold the bending portion behind the chip connection area.

Shape memory alloy actuators replace electronic cropping by physically rotating the lens module, maintaining resolution while countering rotational movements.

Segmented flexible printed circuit routing with dedicated ground returns minimizes magnetic field interference between the battery loop and speaker.

Transparent elastic part forms convex lens surfaces on rigid lenses to refract light across a stretchable substrate.

Lateral movement of segmented printed circuit boards reduces tensile stress on carrier tapes, preventing damage during assembly.

A stretchable auxiliary member mediates stress at the boundary between rigid and flexible regions of a circuit board.

A monolithic molded electronic assembly embeds components in hardened insulating material and applies solderless conductive circuits.

Bending a flexible circuit vertically reduces assembly volume while minimizing signal interference in compact modules.

Restrictive film layers distribute stress at rigid-flex circuit board transitions, preventing mechanical failure during bending.

An elastic PCB region decouples mechanical stress from sensitive shunt components, improving thermal management and power control reliability.

Leaked adhesive forms tapered inclined surface on reinforcing board end surface, preventing sheet material separation under stress.

Segmenting the insulating layer into distinct resin materials resolves flexibility and adhesion trade-offs, preventing haloing during via hole formation.

Curved reinforcement edges disperse stress concentrations at the boundary between reinforced and non-reinforced areas, preventing fractures during bending.

A variable pliability substrate houses rigid electronics and flexible sensors to maintain stable contact with curved body surfaces.

Routing a flexible printed circuit board through the hinge area accommodates more wires without consuming internal space reserved for battery capacity.

Flexible printed circuit couplings enable orthogonal positioning of board portions, improving signal routing and airflow in constrained enclosures.

Overlapping adhesive films increase adhesion force on a flexible printed circuit board, preventing peel-off from restoring forces in curved displays.

Slits in the flexible printed circuit board segment the structure, reducing stress concentration that causes peeling off or broken wiring on curved displays.

A portable computing device display module uses a single piece housing with embedded metal reinforcement for structural support.

Conductor tracks extend into transverse edge strips, maintaining stability and preventing deformation risks when bending the printed circuit board.

A stretchable device uses nested serpentine interconnects to maintain electrical connectivity during deformation.

A stretchable electronic device adjusts the number of active light emitting units per unit area to maintain consistent brightness across different substrate states.

A bulb-type light source uses a segmented substrate to position LED chips at varied angles for uniform omnidirectional light emission.

A flexible display substrate divides its non-display area into independent carrying units separated by buffer members to isolate mechanical stress.

Segmented conductive sheet connects FET terminals to bus bars, suppressing heat generation and improving thermal dissipation.

Anisotropic conductive film adhesive bonding secures flexible conductor tracks to electronic modules.

A flexible circuit film uses a rigid guide film to protect wirings from physical damage at bends.

An etching resist protects joints and opening portions from damage during metal support layer formation, suppressing detachment.

A connection layer with cutouts filled with thermosetting material forms durable electrical bonds on flexible substrates.

Island-shaped inorganic layer segments reduce organic planarization material usage in flexible display bending areas.

Curved wiring portions in stretchable flexible substrates distribute mechanical stress, preventing wire breakage at bend points.

A flexible circuit board maintains a regular bending structure within a mobile terminal connection.

A flexible substrate resin layer adjusts elastic moduli and film thickness to match surface curvature for uniform deformation.