Thin Multichip Flex-Module Foldable Frame Design
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Solution Overview
Problem
Current multichip module technology is expensive due to low volume, custom applications, and lacks reliable high-volume sources for 'known good die,' making it unsuitable for mass market memory modules like SIMM and DIMM, which require higher performance and lower costs.
Innovation Solution
A thin multichip module design using a foldable frame and flex circuit with integrated circuit chips, allowing for higher volume production, lower manufacturing costs, and active cooling, while maintaining backward compatibility with industry standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multichip module technology is used to improve system performance and packaging density, then chip-to-chip communication distance is shortened and operating speeds increase, but manufacturing cost increases due to low volume custom applications
Solution Approach 1:
The patent applies universality by designing a standardized multichip module that can be used across multiple applications and platforms. The module uses industry-standard packaging and mounting techniques that can be manufactured in high volumes, eliminating the need for custom low-volume production. This allows the same module design to serve different computing platforms, thereby reducing per-unit manufacturing costs while maintaining high performance characteristics.
2Quantity of substance
If multichip module technology is used to increase packaging density, then more chips can be interconnected on a single substrate, but the technology becomes too expensive for mass market applications
Solution Approach 1:
The patent applies segmentation by dividing the multichip module into standardized, modular components that can be independently manufactured and then assembled. This segmentation allows each module to be produced in high volumes using standardized processes, and enables flexible configuration to meet different market demands. The modular approach reduces tooling costs and allows for economies of scale, making high-density packaging affordable for mass market applications.
3Ease of manufacture
If memory modules are assembled on small area printed circuit boards using highly automated processes, then material and assembly costs are reduced, but performance is limited to operating at or below 800 MHz
Solution Approach 1:
The patent applies flexible substrates instead of rigid printed circuit boards to enable shorter interconnect paths between chips. The flexible nature of these substrates allows for optimized routing and reduced signal transmission distance, which improves signal integrity and enables higher operating frequencies. This approach maintains compatibility with automated assembly processes while achieving performance levels above 800 MHz that were previously unattainable with conventional PCB-based designs.
Data Source
AI summary
A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.