Flexible Circuit Board on Bus Bars for Heat Dissipation
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Solution Overview
Problem
Conventional circuit boards face heat generation issues due to large current conduction, leading to thermal damage and potential faults in connection members, with existing solutions failing to adequately address these problems.
Innovation Solution
A circuit board design featuring conductive pieces connected to semiconductor elements with insulation regions and conductive sheets that include first and second connection portions to enhance electrical connectivity while minimizing heat generation, using a conductive sheet connected to a second conductive piece via these portions and an inner conductive portion for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conductive members are used to conduct large current, then current conduction capability is improved, but heat generation increases causing thermal damage
Solution Approach 1:
The conductive path is segmented into multiple parallel conductive members (first conductive member and second conductive member) connected to different terminals of the semiconductor element. This segmentation distributes the large current across multiple paths, reducing the current density and heat generation in each individual conductor while maintaining total current conduction capability.
Solution Approach 2:
Multiple conductive members are merged into a unified electrical connection system where the first and second conductive members work together in parallel to conduct current from different terminals of the semiconductor element to the external circuit, collectively handling large current while distributing thermal load.
2Power
If connection members conduct large current, then power transmission is improved, but reliability decreases due to thermal damage and disconnection
Solution Approach 1:
The single connection path is segmented into multiple parallel connection paths through the first and second conductive members. This provides redundancy and distributes thermal stress, preventing any single connection point from failing due to excessive heat while maintaining power transmission capability.
Solution Approach 2:
The invention provides beforehand cushioning by creating alternative current paths through multiple conductive members. If one connection path experiences thermal stress or potential disconnection, the other paths remain available to maintain electrical connection, cushioning against complete connection failure.
3Ease of manufacture
If conventional electrical connection box is used, then basic electrical connection is achieved, but heat dissipation is insufficient causing secondary thermal damage
Solution Approach 1:
Different regions of the electrical connection system are assigned different functions: the first conductive member connects to the first terminal, the second conductive member connects to the second terminal, and each has dedicated connection portions. This local differentiation optimizes heat distribution and dissipation pathways while maintaining ease of manufacture through standardized connection structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses heat generation in connection members, prevents faults caused by heat, and improves heat dissipation efficiency, ensuring reliable electrical connections and reduced resistance.
Implementation Method 1
a conductive sheet that is connected to a second conductive piece via a first connection portion and electrically connects a first terminal of the semiconductor element to the second conductive piece
Implementation Method 2
a large amount of heat is emitted by the conductive members due to conducting a large current
Implementation Method 3
a second connection portion that is provided in the conductive sheet and electrically connects the first terminal and the second conductive piece
Data Source
AI summary
A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.


