Inverted Flexible-Rigid Circuit Board for Periscope Camera Height Reduction
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Solution Overview
Problem
The periscope camera module's size, particularly its height, is a challenge due to the limited installation space in electronic devices, and the existing circuit board structure limits the reduction of size while maintaining functionality.
Innovation Solution
A circuit board design with a flexible and rigid layer configuration, where the flexible layer is bent to invert the bending portion relative to the chip connection portion, reducing the overall height and size of the periscope camera module by eliminating unnecessary structural components and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board uses a traditional T-shaped structure with multiple bending portions, then the functionality and connectivity are ensured, but the height and overall size of the periscope camera module increase
Solution Approach 1:
The circuit board is divided into a rigid circuit board layer and a flexible circuit board layer, allowing independent optimization of each layer's function. The rigid layer provides structural support and stable mounting surfaces, while the flexible layer enables compact routing and inversion bending to reduce module height.
Solution Approach 2:
The circuit board transitions from a planar two-dimensional layout to a three-dimensional folded structure through the inversion bending of the flexible layer. This allows the board to occupy less space in the height direction while maintaining all necessary connection paths and functional areas.
2Volume of moving object
If the flexible part is exposed after bending to avoid tearing, then the structural integrity is maintained, but the size reduction goal is compromised
Solution Approach 1:
The circuit board combines rigid and flexible materials in a layered composite structure. The rigid layer provides tear resistance and structural stability, while the flexible layer performs the bending function. This composite design allows the flexible part to be inverted and tucked without exposing vulnerable areas, as the rigid layer protects against tearing.
3Ease of manufacture
If multiple bending steps are used in the assembly process, then the circuit board can be configured correctly, but the manufacturing complexity and time increase
Solution Approach 1:
The flexible circuit board layer is pre-formed with the inversion bend configuration before final assembly. This preliminary shaping allows the circuit board to be inserted into the periscope camera module in a single step, eliminating the need for multiple bending operations during assembly and significantly reducing manufacturing time.
4Adaptability or versatility
If the circuit board is designed to accommodate more components, then the functionality is enhanced, but the area occupied by the circuit board increases
Solution Approach 1:
The flexible circuit board layer is inverted and tucked underneath the rigid layer, utilizing the vertical space within the module rather than expanding the horizontal footprint. This three-dimensional configuration allows the circuit board to accommodate all necessary components and connections while occupying minimal area on the module surface.
Data Source
AI summary
A circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection portion, and a bending portion. The chip connection portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion is connected to the chip connection portion in an invertible manner, after the bending portion is inverted to the rear side of the chip connection portion, a part of the flexible circuit board layer of the bending portion and a part of the flexible circuit board layer of the chip connection portion are arranged face-to-face.