Orthogonal Mid-Plane Circuit Board Assembly With Flexible Coupling
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Solution Overview
Problem
In high-availability IT infrastructure, existing flexible circuit board designs face challenges in efficiently routing signals and providing adequate cooling within limited enclosure space, complicating electrical coupling and ventilation.
Innovation Solution
A mid-plane assembly with orthogonal positioning and flexible electrical coupling assemblies, including flexible printed circuit boards, allows for side-to-side signal routing and incorporates cooling passages to enhance airflow and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional rigid circuit board designs are used, then electrical coupling is stable, but signal routing flexibility and cooling efficiency are reduced
Solution Approach 1:
The circuit board is divided into multiple separate portions (first circuit board portion, second circuit board portion, third circuit board portion) that can be independently positioned and routed. This segmentation allows signals to be distributed across different physical locations and orientations, providing routing flexibility while maintaining electrical connectivity through the flexible electrical coupling assemblies.
Solution Approach 2:
The circuit board portions are positioned at different orientations (orthogonal and non-orthogonal angles) relative to each other, transitioning from a traditional planar 2D layout to a 3D spatial configuration. This dimensional change enables signals to route around obstacles and access different areas of the enclosure, improving routing flexibility and cooling efficiency.
2Productivity
If more circuit board portions are added for signal routing, then signal distribution improves, but enclosure space consumption increases
Solution Approach 1:
By positioning circuit board portions in three-dimensional space at various angles rather than expanding them in a single plane, the design achieves improved signal routing efficiency without proportionally increasing the footprint area. The orthogonal and non-orthogonal arrangements utilize vertical and diagonal spaces within the enclosure.
Solution Approach 2:
The multiple circuit board portions are arranged in a nested-like configuration where they share common mounting structures and electrical coupling points. The first, second, and third circuit board portions are interconnected through shared flexible electrical coupling assemblies, allowing compact arrangement that minimizes overall space consumption.
3Area of stationary object
If circuit board portions are positioned orthogonally for compact arrangement, then space utilization improves, but manufacturing and assembly complexity increases
Solution Approach 1:
The flexible electrical coupling assemblies incorporate flexible printed circuit boards that can accommodate angular variations and positioning tolerances. This flexibility allows the rigid circuit board portions to be positioned at precise orthogonal angles for optimal space utilization, while the flexible couplings absorb assembly variations without requiring complex adjustment mechanisms.
Solution Approach 2:
The flexible electrical coupling assemblies serve multiple functions: they provide electrical connectivity between circuit board portions, accommodate angular positioning (orthogonal and non-orthogonal), and allow for thermal expansion and contraction. This multi-functionality reduces the need for separate components for each function, simplifying the overall manufacturing process.
Data Source
AI summary
A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.