Flexible Circuit Bending for Compact Electronic Assembly
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Solution Overview
Problem
The challenge is to develop an electronic element assembly that achieves a circuit structure with extreme dimensions to enhance design density, particularly for portable electronic devices like camera modules and image sensor modules.
Innovation Solution
The solution involves an electronic element assembly comprising a first electronic element, an electronic element board, and a flexible circuit. The first electronic element is disposed on the electronic element board, which includes first and second circuits. The flexible circuit has a connecting portion, a bending portion, and an electronic path, allowing the first and second ends of the electronic path to be connected to the first and second circuits respectively, while the bending portion bends along the thickness direction of the electronic element board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional rigid circuit board structure is used, then the circuit layout is simple and easy to manufacture, but the design density is low and the volume is large
Solution Approach 1:
The flexible circuit board utilizes the thickness direction (Z-axis) of the assembly as a third dimension for routing signals. The bending portion extends along the thickness direction of the electronic element board, allowing the circuit to achieve extreme dimensions in the vertical direction rather than only in the planar direction, thereby reducing the footprint area and overall volume.
Solution Approach 2:
The flexible circuit board replaces the conventional rigid circuit board with a dynamic, bendable structure. The bending portion can be flexed along the thickness direction to achieve compact three-dimensional routing, enabling the circuit to adapt to limited space requirements while maintaining electrical connectivity between components.
2Reliability
If the circuit is extended to connect distant electronic elements, then the connectivity is achieved, but the signal interference and electromagnetic interference increase
Solution Approach 1:
By routing the circuit in the thickness direction through the bending portion, the signal path is shortened in terms of horizontal distance while maintaining functional connectivity. This vertical routing approach reduces the lateral expansion of the circuit, thereby minimizing the area exposed to electromagnetic interference and signal crosstalk.
3Device complexity
If the electronic element board is made larger to accommodate all circuits, then the circuit layout is simplified, but the design density is reduced
Solution Approach 1:
The flexible circuit board transitions the circuit layout from a two-dimensional planar arrangement to a three-dimensional structure utilizing the thickness direction. The bending portion allows the circuit to fold vertically, achieving compact routing without increasing the planar footprint, thereby maintaining high design density while preserving circuit layout simplicity.
4Volume of moving object
If a flexible circuit with bending portion is used to reduce volume, then the design density is enhanced, but the mechanical strength may be compromised
Solution Approach 1:
The flexible circuit board is segmented into distinct functional portions: a connecting portion that maintains rigid connection to the electronic element board, a bending portion that provides flexibility for compact routing, and an electronic path portion that carries the circuit traces. This segmentation allows each portion to be optimized for its specific function, with the connecting portion providing mechanical strength and the bending portion enabling volume reduction.
Solution Approach 2:
Different portions of the flexible circuit board have different mechanical properties tailored to their functions. The connecting portion is designed with higher rigidity to ensure stable electrical connection, while the bending portion is designed with appropriate flexibility to enable compact three-dimensional routing. This local differentiation of mechanical properties maintains overall structural strength while achieving volume reduction.
Data Source
AI summary
An electronic element assembly includes a first electronic element, an electronic element board and a flexible circuit. The first electronic element is disposed on the electronic element board, and the electronic element board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are disposed on relative sides of the first electronic element, respectively. The flexible circuit is disposed on the electronic element board, and the flexible circuit includes a connecting portion, a bending portion and an electronic path. The connecting portion is connected to the electronic element board. The bending portion is disposed on a side of the connecting portion away from the first electronic element. At least one portion of the electronic path is disposed on the bending portion.