Flexible Circuit Board Air Medium Layer Signal Loss Reduction
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Solution Overview
Problem
Existing flexible circuit boards face challenges in minimizing signal loss due to high dielectric constants of materials used, which affect the transmission of signals, especially in applications requiring flexibility and weight control.
Innovation Solution
A flexible circuit board design featuring a circuit layer with a linear signal line surrounded by hollow areas and a bonding layer creating an air medium layer, reducing signal loss by using a dielectric constant of 1.0 for the air medium, and an electromagnetic shielding structure with conductive holes to protect against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional dielectric materials are used in flexible circuit boards, then structural integrity and support are maintained, but signal loss increases due to high dielectric constants
Solution Approach 1:
The patent introduces hollow areas within the circuit board structure that are filled with air, creating a porous configuration. Air has a dielectric constant of approximately 1.0, which is significantly lower than traditional dielectric materials. This porous structure reduces the overall dielectric constant of the board, thereby minimizing signal loss and improving signal transmission efficiency while maintaining structural integrity through the distributed hollow area design.
Solution Approach 2:
The patent creates a composite structure by combining traditional dielectric materials with air-filled hollow areas. This composite approach allows the board to leverage the mechanical strength of solid dielectric materials while incorporating the low dielectric constant property of air, achieving a balance between structural reliability and signal transmission efficiency.
2Adaptability or versatility
If flexible materials are used to achieve ductility and flexibility, then weight control and adaptability are improved, but signal transmission quality deteriorates due to material properties
Solution Approach 1:
The patent applies local quality by creating specific hollow areas at strategic locations within the circuit board where signal transmission is critical. Rather than uniformly changing the entire board structure, the hollow areas are localized to regions where they provide maximum benefit for signal integrity while maintaining the overall flexibility and adaptability of the flexible circuit board.
3Object-affected harmful factors
If solid dielectric materials are used throughout the circuit board, then manufacturing simplicity is maintained, but electromagnetic interference protection is insufficient
Solution Approach 1:
The patent segments the circuit board structure by introducing multiple hollow areas distributed throughout the board. These segmented hollow areas serve dual purposes: they reduce the overall dielectric constant for better signal transmission and create electromagnetic shielding effects by disrupting electromagnetic field propagation. This segmentation approach provides enhanced EMI protection without requiring a complete redesign of the entire board structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces signal loss and enhances electromagnetic shielding, improving signal transmission efficiency and protection in flexible circuit boards.
Implementation Method 1
reducing signal loss by using a dielectric constant of 1.0 for the air medium
Implementation Method 2
an electromagnetic shielding structure with conductive holes to protect against electromagnetic interference
Data Source
AI summary
A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.