Flexible Circuit Board with Bent Interconnect Substrate
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Solution Overview
Problem
Circuit boards designed for measuring biological signals face issues with maintaining reliable connections and stable signal acquisition due to the expansion and contraction of flexible interconnect substrates, which can lead to broken connections and unstable measurements.
Innovation Solution
A circuit board design featuring a flexible interconnect substrate supported by a rigid or flexible support member, where the substrate is bent around the support member to reduce expansion and contraction, ensuring stable connections and minimizing changes in electrode distance, thereby enhancing measurement stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible or elastic material is used for the interconnect substrate to increase conformability, then the conformability is improved, but the connection reliability deteriorates due to expansion and contraction
Solution Approach 1:
The interconnect substrate is divided into two distinct regions: a circuit region with electronic components that remains relatively stable, and an electrode region that can expand and contract. This segmentation allows each region to serve its specific function independently, maintaining connection reliability while preserving conformability.
Solution Approach 2:
Different regions of the interconnect substrate are given different properties. The circuit region is designed with stable characteristics to ensure reliable connections, while the electrode region is allowed to be more flexible to maintain conformability. This local differentiation resolves the contradiction between overall flexibility and localized stability.
2Adaptability or versatility
If a flexible or elastic material is used for the interconnect substrate to increase conformability, then the conformability is improved, but the measurement precision deteriorates due to changes in distance between external electrodes
Solution Approach 1:
The substrate is segmented into a circuit region and an electrode region. The electrode region is specifically designed to accommodate expansion and contraction without significantly changing the distance between external electrodes, thereby maintaining measurement precision while preserving conformability through the flexible material.
Solution Approach 2:
The electrode region is given special local properties that allow it to be more tolerant of dimensional changes. This localized quality ensures that even though the overall substrate is flexible and conformable, the critical measurement area maintains sufficient precision.
3Adaptability or versatility
If the interconnect substrate is made flexible to improve conformability, then the conformability is improved, but the structural stability deteriorates
Solution Approach 1:
The interconnect substrate is segmented into a stable circuit region and a flexible electrode region. This segmentation allows the circuit region to maintain structural stability for reliable component mounting, while the electrode region provides the necessary flexibility for conformability.
Solution Approach 2:
Different regions of the substrate are assigned different stability characteristics. The circuit region is designed with higher structural stability to support electronic components, while the electrode region is designed with lower stability to enable conformability. This local differentiation resolves the contradiction between overall flexibility and localized stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures reliable connections with electronic components and stable signal acquisition by reducing substrate expansion and contraction, improving the circuit board's flexibility and layout freedom while maintaining cost-effectiveness.
Implementation Method 1
an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member
Data Source
AI summary
A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.