Flexible Circuit Board Anti-Peeling Bypass Wire Design
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Solution Overview
Problem
Fine line traces on small-size flexible circuit boards are prone to peeling during the punching process, which affects yield improvement in manufacturing.
Innovation Solution
Incorporating anti-peeling portions on bypass wires with a specific distance from the cutting line, creating a blank area that supports the bypass transmission portion to prevent peeling, and optimizing the width of wire segments to reduce abrasion and wear during punching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If reel-to-reel method is used to convey flexible circuit boards during manufacturing processes, then productivity is improved, but fine line traces adjacent to cutting line are easily peeled away
Solution Approach 1:
The bypass wire is segmented into two distinct portions: a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. This segmentation allows each portion to serve its specific function - signal transmission and peeling prevention respectively - thereby resolving the contradiction between maintaining productivity and preventing trace peeling.
Solution Approach 2:
Different portions of the bypass wire are assigned different functions and structural characteristics. The anti-peeling portion is specifically positioned at a distance of 100-400 μm from the cutting line to provide localized support and prevention against peeling forces during the punching process, while the bypass transmission portion maintains signal transmission functionality.
2Reliability
If anti-peeling portion is disposed on bypass wire at specific distance from cutting line, then peeling protection is improved, but device complexity increases
Solution Approach 1:
The bypass wire is designed to serve multiple functions: the bypass transmission portion provides signal transmission capability while the anti-peeling portion provides mechanical support and peeling prevention. This multi-functionality approach allows a single wire structure to address both electrical and mechanical requirements without significantly increasing overall device complexity.
Solution Approach 2:
The anti-peeling portion of the bypass wire serves itself by utilizing its own structural presence in the nonworking area to provide support and prevent peeling of the bypass transmission portion. The wire structure itself becomes the protective element, eliminating the need for additional separate protective components.
Data Source
AI summary
A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.