Flexible Circuit Board for All-in-One Chip on Film
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Solution Overview
Problem
Conventional flexible circuit boards for chip-on-film (COF) methods require multiple printed circuit boards, leading to increased thickness and reduced miniaturization potential, as well as poor bonding reliability, which complicates the connection between display panels and main boards in electronic devices.
Innovation Solution
A flexible circuit board for all-in-one chip on film with a substrate featuring a conductive pattern part comprising a first and second conductive pattern part, each with a wiring pattern layer and plating layers, and a protective layer, allowing for the direct connection of different types of chips on a single substrate, thereby reducing the need for multiple printed circuit boards and enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple printed circuit boards are used to connect display panel and main board, then connection functionality is achieved, but device thickness increases and miniaturization is limited
Solution Approach 1:
The patent merges multiple separate printed circuit boards into a single flexible circuit board with multiple conductive pattern parts. Each conductive pattern part includes wiring patterns, plating layers, and protective layers that enable direct connection between the display panel and main board, eliminating the need for intermediate circuit boards and reducing overall device thickness.
Solution Approach 2:
The flexible circuit board is designed with multi-functionality to perform the roles of multiple separate circuit boards. By incorporating multiple conductive pattern parts with different configurations on a single substrate, the board can handle various signal types and connection requirements that previously required separate dedicated circuit boards.
2Ease of operation
If multiple printed circuit boards are used, then connection functionality is achieved, but bonding reliability deteriorates
Solution Approach 1:
The patent combines multiple circuit board functions into one integrated flexible circuit board, eliminating multiple bonding interfaces between separate boards. This reduces the number of potential failure points from poor bonding while maintaining all necessary connection functionalities through carefully designed conductive patterns and plating layers.
3Adaptability or versatility
If multiple printed circuit boards are used, then different chip types can be connected, but device complexity increases
Solution Approach 1:
The flexible circuit board incorporates multiple conductive pattern parts with varying configurations on a single substrate, enabling direct connection of different chip types (such as COF chips, COG chips, and CSTN chips) without requiring separate dedicated circuit boards for each chip type. This universal design reduces device complexity while maintaining adaptability.
Solution Approach 2:
The circuit board is segmented into multiple conductive pattern parts, each optimized for specific chip types or connection requirements. This segmentation allows different regions of the board to handle different chip configurations while maintaining an integrated single-board structure, reducing overall device complexity.
Data Source
AI summary
A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.