Flexible Circuit Board Manufacturing Yield and Reliability
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Solution Overview
Problem
Current methods for manufacturing flexible circuit boards face challenges that need improvement, particularly in the processes of forming flexible substrates and circuit strings, which affect the efficiency and reliability of the final product.
Innovation Solution
A method involving the use of a carrier substrate to form a flexible substrate, followed by the creation of circuit strings with specific metal layers and solder resist layers, and subsequent cutting and winding processes to produce flexible circuit tapes and chains, ultimately forming a flexible circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional methods are used to form flexible substrates and circuit strings, then the manufacturing process is simpler, but the yield and reliability of the flexible circuit board are reduced
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming flexible substrate, forming circuit strings with specific metal layers, applying solder resist layers, cutting into tapes, and winding into chains. This segmentation allows each stage to be optimized independently, improving overall yield and reliability while maintaining manageable process complexity.
Solution Approach 2:
The method performs preliminary actions by first forming the flexible substrate on a carrier, then systematically building up metal layers and solder resist layers before cutting and winding. This preliminary structuring ensures proper electrical connections and mechanical properties are established before final assembly, enhancing reliability.
2Manufacturing precision
If the flexible substrate is formed without a carrier substrate, then the process steps are reduced, but the manufacturing precision and electrical connection quality deteriorate
Solution Approach 1:
A carrier substrate is introduced as an intermediary element during the manufacturing process. The carrier substrate supports the flexible substrate during metal layer formation and solder resist application, ensuring precise electrical connections. The carrier is later removed, having served its purpose as a temporary support structure that enabled high-precision manufacturing.
Solution Approach 2:
The carrier substrate is used in preliminary stages to establish precise electrical connections and mechanical properties before the final product form is created. This preliminary support structure enables manufacturing precision that would be difficult to achieve without it, even though it adds process steps.
Data Source
AI summary
A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.