Resist Details TRIZ Cases

A low-phosphorus nickel layer protects circuit-board wires while selective coating removal helps maintain production efficiency.

A wiring circuit board assembly sheet uses a dummy pattern in the margin region to stabilize etching solution flow.

An inclined insulating face directs reflected exposure light away from photoresist areas to maintain conductive pattern geometry during lithography.

Inkjet printing forms a resist layer using monofunctional and polyfunctional oligomers to define etching patterns on target surfaces.

Inserting a light guide into vias selectively exposes photoresist, eliminating stubs that degrade signal integrity in multi-layer PCBs.

A liquid solder resist composition uses rutile titanium dioxide from sulfuric and chlorine methods to form a high-reflectivity layer.

An inclined insulating face redirects metal thin film light reflection to ensure accurate photoresist exposure for conductive pattern formation.

A black chromium oxide layer on copper foils enables direct laser boring for blind via holes, preventing undercut formation and improving fine wiring precision.

A printed circuit board incorporates stiff supporting patterns to maintain structural integrity during thin substrate fabrication.

Inclined insulating faces guide reflected light to focus between photoresist exposure portions during photolithography.

Segmented manufacturing stages with carrier support improve yield and reliability of flexible circuit boards despite added process complexity.