Wired Circuit Board Inclined Face Light Reflection Control
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Solution Overview
Problem
Existing methods for producing small-sized wired circuit boards face difficulties in forming wiring patterns with angles between 60 degrees and 90 degrees, leading to inadequate pattern formation and potential breakage or short circuits.
Innovation Solution
A method involving an insulating layer with an inclined face and a flat face, where a metal thin film is applied on the inclined face, and photoresist is exposed to light through a photomask to reduce light reflection and ensure accurate conductive pattern formation, with optional steps of roughening the inclined face and reducing the metal thin film's reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a wiring pattern is formed on an insulating layer with a boundary face (as in conventional methods), then the wiring pattern can be formed with standard angles, but light reflection at the boundary face causes inadequate pattern formation and potential breakage or short circuits
Solution Approach 1:
The patent applies asymmetry by forming an inclined face on the insulating layer with a specific angle (α) between 150° and 168°, rather than using a symmetric boundary face. This asymmetric inclined face redirects light reflection away from the wiring pattern formation area, preventing inadequate pattern formation and connection failures while maintaining manufacturing precision.
Solution Approach 2:
The patent changes the geometric parameter of the insulating layer surface by introducing an inclined face with a specific angle range (150°-168°). This parameter change modifies the light reflection characteristics, directing reflected light away from the exposure area and eliminating the harmful effects of light reflection on wiring pattern formation.
2Manufacturing precision
If the insulating layer has an inclined face with a metal thin film, then light reflection is reduced and pattern formation is improved, but the device structure becomes more complex
Solution Approach 1:
The patent applies preliminary action by forming the inclined face on the insulating layer before depositing the metal thin film. This sequence ensures that the inclined face geometry is established first, which then guides the light reflection behavior during subsequent exposure, improving conductive pattern formation without requiring complex structural modifications.
Solution Approach 2:
The metal thin film acts as an intermediary layer on the inclined face, mediating the interaction between light and the insulating layer structure. This intermediary layer helps control light reflection characteristics while maintaining the simplified inclined face geometry, thus improving pattern formation accuracy without significantly increasing device complexity.
3Adaptability or versatility
If a complicated wiring pattern is used in small-sized circuit boards, then functional requirements are met, but it becomes difficult to form the wiring pattern with the required angles, leading to inadequate formation
Solution Approach 1:
The asymmetric inclined face with angle α between 150° and 168° provides a geometric configuration that redirects light reflection away from the wiring pattern area. This asymmetric structure enables the formation of complicated wiring patterns with various angles without suffering from light reflection-induced defects, thus maintaining both design flexibility and formation quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the reliable formation of conductive patterns with high flexibility, preventing deformation and ensuring excellent connection reliability in the wired circuit board.
Implementation Method 1
when exposing the photoresist to light, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion
Data Source
AI summary
The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.