PCB Supporting Patterns for Thin Board Fabrication
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Solution Overview
Problem
Current methods for fabricating thin printed circuit boards (PCBs) using carrier substrates lack reliability and efficiency, particularly in maintaining structural integrity and preventing damage during fabrication.
Innovation Solution
The PCB design incorporates a supporting pattern that is stiffer than the via pad patterns, with via pad patterns spaced apart and connected by a via pad connecting pattern at the same level, and a method involving multiple substrates with insulating core and supporting substrates to ensure structural support and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a carrier substrate is used to form thin PCBs, then the thickness of the PCB is reduced, but the structural integrity and reliability during fabrication deteriorate
Solution Approach 1:
The patent introduces supporting patterns and rigidifying structures during the fabrication process that are removed after the PCB is formed. These preliminary support structures prevent bending and oscillation during manufacturing, enabling reliable fabrication of thin PCBs that would otherwise be too fragile to handle
Solution Approach 2:
The patent changes the physical parameters of the PCB structure by introducing additional supporting layers and rigidifying patterns that temporarily increase the stiffness during fabrication. After fabrication, these supporting structures are removed, returning the PCB to its thin final form while having already ensured fabrication reliability
2Manufacturing precision
If via pad patterns are spaced apart to reduce interference, then manufacturing precision is improved, but electrical connectivity and structural support deteriorate
Solution Approach 1:
The patent introduces via pad connecting patterns as intermediary elements that electrically connect spaced-apart via pad patterns. These connecting patterns serve as mediators that maintain electrical continuity even when via pads are separated to reduce interference and improve manufacturing precision
Solution Approach 2:
The patent extends the via pad structure from simple circular pads to include connecting patterns that create a grid-like or mesh structure. This dimensional extension provides both electrical connectivity pathways and additional structural support without requiring the via pads to be closely spaced
3Volume of moving object
If the PCB is made thinner to meet miniaturization requirements, then the size and weight are reduced, but the structural strength and resistance to bending deteriorate
Solution Approach 1:
The patent introduces supporting patterns and rigidifying structures during the fabrication process that are removed after the PCB is formed. These preliminary support structures prevent bending and oscillation during manufacturing, enabling reliable fabrication of thin PCBs that would otherwise be too fragile to handle
Solution Approach 2:
The patent creates a composite structure during fabrication by combining the thin PCB substrate with additional supporting patterns and rigidifying structures. This temporary composite provides the necessary bending resistance during manufacturing, and is subsequently reduced to the final thin form
Data Source
AI summary
A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.