Segmented Circuit Board with Flexible Interconnects for Space Reduction
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Solution Overview
Problem
Current circuit board structures for TFT-LCD displays occupy large plane spaces due to the integration of driving and power ICs, which limits design flexibility and increases the size of the display panel.
Innovation Solution
A circuit board structure featuring at least two mounting substrates with a flexible conductive substrate that bends to form a protruding part, reducing the distance between adjacent mounting substrates and replacing traditional routing areas, thereby minimizing the plane space occupied while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driving IC and power IC are integrated on one PCB, then electrical functionality is complete, but the PCB occupies large plane space
Solution Approach 1:
The circuit board is divided into multiple mounting substrates (first mounting substrate, second mounting substrate, third mounting substrate) that are spatially separated. Each substrate mounts specific electrical components independently, allowing the PCB to be segmented into smaller units that occupy less plane space while maintaining complete electrical functionality through inter-substrate connections via flexible conductive substrates.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional spatial configuration by stacking mounting substrates vertically and using flexible conductive substrates to connect them in the thickness direction. This dimensional change allows electrical components to be distributed in the Z-direction rather than spreading out in the XY-plane, significantly reducing the PCB's footprint area.
2Ease of manufacture
If PCB length or width is increased to accommodate integrated ICs, then all electrical components can be mounted, but the display panel requires more plane space
Solution Approach 1:
The PCB is segmented into multiple smaller mounting substrates that can be manufactured independently and then assembled in a stacked configuration. This segmentation allows each substrate to be compact while the overall system maintains full component mounting capability through vertical stacking, thereby reducing the display panel's plane space requirements.
Solution Approach 2:
Flexible conductive substrates are used to connect the mounting substrates in the thickness direction. These flexible films provide electrical connections between stacked substrates without requiring additional plane space, enabling compact vertical integration that reduces the overall display panel area while maintaining complete electrical functionality.
3Length of stationary object
If flexible conductive substrate bends to form protruding part, then distance between mounting substrates is shortened, but structural complexity increases
Solution Approach 1:
The flexible conductive substrate is designed to be bendable and formable into protruding parts with specific shapes (including first and second bending sections). This dynamic flexibility allows the substrate to be molded into compact configurations that shorten the distance between mounting substrates while maintaining electrical connectivity, achieving space reduction through controlled deformation rather than rigid complex structures.
Data Source
AI summary
The present disclosure provides a circuit board structure and a display panel, the circuit board structure includes mounting substrates and a flexible conductive substrate, and the flexible conductive substrate is connected between two adjacent mounting substrates to connect the two mounting substrates together.