Flexible Printed Circuit Board With Non-Uniform Circuit Pattern Thickness
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Solution Overview
Problem
Flexible printed circuit boards used in foldable electronic devices face challenges in maintaining reliability and durability when subjected to repeated bending and folding, especially with thin and light conductive wires, as they struggle to distribute external forces effectively.
Innovation Solution
The solution involves a flexible printed circuit board design with a base film divided into flexible and rigid areas, where the circuit pattern in the flexible area is thinner than in the rigid area, and a coverlay film covering both, allowing for improved force distribution during bending and folding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If thin and light conductive wires are used in the flexible printed circuit board, then the flexibility and weight are improved, but the reliability and durability under repeated bending and folding forces deteriorate
Solution Approach 1:
The patent applies local quality by making the circuit pattern thickness non-uniform: thinner in flexible areas to maintain flexibility and reduce weight, and thicker in rigid areas to ensure reliability under repeated bending and folding forces. This localized variation in thickness allows each region to have optimal properties for its specific function.
2Ease of manufacture
If the circuit pattern has uniform thickness throughout, then the manufacturing process is simplified, but the ability to distribute external forces during bending and folding deteriorates
Solution Approach 1:
The circuit pattern is designed with different thicknesses in different regions: thinner in flexible areas for flexibility and thicker in rigid areas for force distribution. This local quality variation optimizes force distribution during bending and folding while maintaining manufacturing feasibility through selective thickness control.
3Adaptability or versatility
If the circuit pattern is made thinner to improve flexibility, then the flexibility is improved, but the wiring reliability deteriorates
Solution Approach 1:
The patent implements local quality by varying the circuit pattern thickness: thinner sections in flexible areas provide the necessary flexibility for bending and folding, while thicker sections in rigid areas ensure wiring reliability. This spatial variation in thickness allows both flexibility and reliability to coexist in different regions of the same circuit board.
Data Source
AI summary
A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.