Flexible Circuit Board Structure With Hollow Portions for Repeated Bending
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flexible circuit boards experience buckling deformation and structural damage due to mismatched bending radii and compressive stress during repeated bending, which reduces their durability and service life.
Innovation Solution
A circuit board design with alternating bending and non-bending areas, incorporating multilayered structures, adhesive layers, and hollow portions to manage stress and match bending radii, enhancing deformation and restoring abilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If adhesive layers are not disposed at the bending area to remain air gaps, then stress during bending is reduced, but buckling deformation occurs due to mismatched bending radii between layers
Solution Approach 1:
The patent introduces hollow portions (porous structure) within the flexible circuit board layers. These hollow portions act as cushions that can be compressed during bending, absorbing the mismatched bending radii between different layers and preventing buckling deformation while maintaining adhesive layer continuity
Solution Approach 2:
The patent changes the physical state of the flexible circuit board by introducing compressible hollow portions that alter the bending radius parameters of different layers. This allows the inner and outer structures to have different effective bending radii, resolving the mismatch that causes buckling
2Adaptability or versatility
If the circuit board undergoes repeated bending, then flexibility and adaptability are improved, but structural damage occurs due to compressive stress and buckling
Solution Approach 1:
The patent预先 (in advance) introduces hollow portions as cushioning structures within the circuit board layers. These cushions are designed to absorb compressive stress before it can cause structural damage, allowing the circuit board to undergo repeated bending without degradation
Solution Approach 2:
The patent creates a composite structure by combining solid flexible circuit board layers with hollow porous portions. This composite design provides both the flexibility needed for repeated bending and the stress-absorbing capability to prevent structural damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces buckling deformation and structural damage, improving the circuit board's durability and extending its service life by allowing stress release and matching bending sizes across layers.
Implementation Method 1
When the at least one bending area is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions
Implementation Method 2
The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure, and adhered to the first flexible material layer and the second cover film
Data Source
AI summary
A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.