Flexible Printed Circuit with Opening Portion for Component Mounting
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Solution Overview
Problem
Conventional flexible printed circuits (FPCs) face limitations in high-density packaging and circuit design liberalization due to the presence of reinforcing plates, which restrict the mounting of electronic components on these areas, thereby hindering compactness and weight reduction in electronic apparatuses.
Innovation Solution
The implementation of a flexible printed circuit structure that includes a flexible board body, a reinforcing plate, an opening portion, and a bent structure, allowing for the formation of mounting regions on both sides of the reinforcing plate without additional structural components, enabling high-density packaging and double-sided FPCs that are low-cost and compact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reinforcing plates are provided to increase mechanical strength, then the mechanical strength is improved, but the ability to mount electronic components is worsened
Solution Approach 1:
The reinforcing plate is segmented by forming opening portions that divide the plate into multiple regions. This segmentation allows electronic components to be mounted on both the reinforcing plate and the flexible board body, resolving the contradiction between maintaining mechanical strength and enabling component mounting.
Solution Approach 2:
Different regions of the FPC are given different properties: the reinforcing plate provides mechanical strength where needed, while opening portions create local areas for component mounting. This local differentiation allows simultaneous achievement of strength enhancement and mounting capability.
2Strength
If reinforcing plates are provided to increase mechanical strength, then the mechanical strength is improved, but the circuit design freedom is worsened
Solution Approach 1:
The reinforcing plate is divided into multiple regions by opening portions, creating distinct mounting areas. This segmentation enables flexible circuit design by allowing components to be strategically placed on both the reinforcing plate and flexible board body according to design requirements.
Solution Approach 2:
The invention utilizes both sides of the reinforcing plate for component mounting (first and second opposing surfaces), effectively adding a dimensional aspect to the design space. This enables greater circuit design freedom without compromising mechanical strength.
3Device complexity
If conventional FPC structure is used, then the structure is simple, but high-density packaging is limited
Solution Approach 1:
The reinforcing plate is segmented into multiple mounting regions through opening portions, creating additional spaces for component placement. This segmentation enables high-density packaging by utilizing both the reinforcing plate and flexible board body for component mounting, without significantly increasing structural complexity.
Solution Approach 2:
The reinforcing plate serves multiple functions: providing mechanical strength and simultaneously serving as a mounting substrate for electronic components. This multi-functionality enables high-density packaging while maintaining structural simplicity, as the same component serves both support and mounting purposes.
Data Source
AI summary
According to one embodiment, FPC has a flexible board body, a reinforcing plate, an opening portion, and a bent structure. The opening portion is formed to penetrate through the board body. The bent structure is bent to pass through the inside of the opening portion.