Circuit Bendability/Stretchability TRIZ Cases

Segmented rigid and flexible substrates reduce stress transmission at joining portions, preventing connection failure and inductance deviation.

Merging isolated bridges onto a carrier structure resolves automation bottlenecks, reducing production costs while maintaining connection precision.

Flexible printed circuit junctions connect movable board segments, reducing occupied space and signal loss compared to traditional connectors.

A stretchable device uses dummy end portions on a resin layer to stabilize electrical coupling between terminals.

Hollow holes in the reinforcement member disperse stress at laminated boundaries, preventing fractures while maintaining structural integrity during bending.

Pre-formed protrusions align with frame grooves to eliminate repeat processing errors during fixing.

Electrospinning forms a porous nano-fiber web, while electroless plating deposits uniform circuits to resolve flexibility and air permeability trade-offs.

An open weave interlocking fabric attached to flex circuits distributes stress and prevents polyimide cracking during bending.

Rollable display panel uses shape memory alloys to unroll on demand, eliminating resource waste from constant outdoor deployment.

Segmented rigid support patterns hold output devices on a flexible substrate, resolving the contradiction between structural stability and global flexibility.

Continuous conductor patterns reinforce cavity boundaries in resin multilayer substrates to prevent cracking from bending stress.

A reinforcing member strengthens the bending area of a flexible circuit board, preventing wiring cracks that compromise reliability when reducing dead space.

Varying bendable region thickness creates non-uniform curvature, resolving flex resistance trade-offs without complex etching.

A curved support structure positions resistive sensors to limit deformation during substrate stretching.

A flexible polymeric film integrates a reinforcement layer containing discrete columns and a lamella to enhance mechanical properties.

A stretchable wiring film uses a meandering structure in the depth direction to maintain electrical conductivity.

An auxetic structure with unit cells controls multidimensional deformation and reduces surface distortion during stretching.

Periodic sensor polling reduces power consumption, allowing a compact coin cell battery in a recessed carrier without increasing device volume.

Curved conductive wires cross to form closed regions that buffer stress during bending, preventing breakage while maintaining compact aesthetics.

Optimizing outer and inner surface radii minimizes convection phenomena in curved parts, ensuring high transparency and appearance quality.

A stretchable electronic device uses a double-level interconnection system with distinct conductive channel geometries to maintain electrical connectivity.

Mechanical pressing forces fluid conductive beads through holes to create reliable, deformable electrical connections without complex lithography.

Spacer elements maintain fixed distance between the light receiver and receiving optics, eliminating optical axis adjustments.

Dual-layer substrates with varying elastic moduli allow stretchable electrodes to expand beyond 20% while maintaining electrical stability.

A support back plate with a thickness gradient reduces device weight while maintaining curvature.

A reinforced flexible printed circuit board portion acts as a cantilever to support the waterproofing member.

A flexible display buffer member uses varying thickness segments to absorb mechanical stress at the bending area.

A rigid-flex printed circuit board structure folds to form an integrated waveguide within a semiconductor device package.

Segmenting the assembly into a rigid carrier and a deformable high density interconnect board resolves manufacturing precision versus construction complexity.

A porous electrospun veil embeds sensors in laminated composites without compromising interlaminar shear strength or resin infiltration quality.

Buried wiring patterns use a thermoplastic resin layer with low elastic modulus to suppress distortion while reducing transmission loss.

An embedded guide member connects copper line layers in a flexible circuit, eliminating height differences that cause dry film breakage during lamination.

A conductive connection structure uses a lamination with segmented through holes filled by paste layers to form pillar portions.

Anchor elements define component positions on deformed flat devices.

Direct printing forms shielding structures on rigid-flex printed circuit boards, eliminating mechanical damage risks and reducing manufacturing costs.

An inclined insulating face directs reflected light upward, resolving inadequate pattern formation on small boards.

A component carrier uses a stepped recess to distribute mechanical stress across flexible regions.

A flexible electrode arrangement uses a conductive wire bent in vertical and horizontal directions to maintain structural integrity.

Graded adhesion strength between insulating resin layers and conductor films prevents pattern peeling and positional deviation during thermocompression bonding.

Radial flexible printed circuit board pads reduce substrate width to expand earphone speaker diaphragm area for improved sound volume.

A flexible circuit board connects to a display panel through an adhesive member with higher elasticity than the curvature region's stress relief component.

Localized copper patterns on a flexible printed circuit board enhance structural strength and thermal conductivity, preventing warping in slim LCD devices.

A printed circuit board uses a reinforcing layer with openings of varying widths to enhance structural rigidity.

Segmented reinforcing plates enable component mounting on both sides, resolving the trade-off between mechanical strength and high-density packaging.

A transparent stretchable substrate uses an auxetic structure to enable multidimensional deformation.