Wired Circuit Board Inclined Insulating Layer
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Solution Overview
Problem
Existing methods for producing small-sized wired circuit boards face difficulties in forming wiring patterns with angles between 60 degrees and 90 degrees, leading to inadequate pattern formation and potential breakage or short circuits.
Innovation Solution
A wired circuit board design featuring an insulating layer with inclined and flat faces, where the supplementary angle between these faces is limited to 20 degrees or less, allowing incident light to be reflected upward and reducing light projection onto the conductive pattern, thereby preventing inadequate formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the wiring pattern is formed with a complicated layout on small-sized circuit boards, then the adaptability and versatility are improved, but the manufacturing precision deteriorates due to inadequate pattern formation
Solution Approach 1:
The patent changes the geometric parameters of the insulating layer by forming an inclined face with a controlled supplementary angle (more than 0° and 20° or less). This parameter modification alters the light reflection characteristics, enabling the reflected light to be projected substantially upward rather than laterally, thus preventing inadequate pattern formation while maintaining layout flexibility
Solution Approach 2:
The patent introduces a dimensional change by creating an inclined face on the insulating layer instead of maintaining a purely horizontal surface. This three-dimensional modification changes the direction of light reflection from a two-dimensional lateral projection to a three-dimensional upward projection, resolving the pattern formation issue while preserving design flexibility
2Manufacturing precision
If the wiring pattern is formed with angles between 60 and 90 degrees as in conventional methods, then the manufacturing precision is maintained, but the adaptability deteriorates when complicated patterns are required
Solution Approach 1:
The patent modifies the geometric parameter of the insulating layer surface by creating an inclined face with a supplementary angle of 20° or less. This parameter change fundamentally alters the light reflection behavior, allowing complicated wiring patterns to be formed without the conventional angle constraints, thus improving adaptability while maintaining precision
3Ease of manufacture
If the insulating layer has a large supplementary angle, then the ease of manufacture is improved, but the manufacturing precision deteriorates due to light reflection affecting pattern formation
Solution Approach 1:
The patent specifies a precise parameter range for the supplementary angle (more than 0° and 20° or less) to optimize both manufacturability and pattern accuracy. This parameter control ensures that the inclined face can be formed with conventional manufacturing methods while preventing harmful light reflection that would degrade pattern formation quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable formation of conductive patterns with high flexibility, preventing breakage and ensuring excellent connection reliability in the circuit board.
Implementation Method 1
the angle formed by the inclined face and the flat face, and a supplementary angle y to the angle formed by the inclined face and the flat face. With the wired circuit board, the supplementary angle y is the above-described upper limit value or less, and therefore the angle formed between incident light and reflected light reflected at the metal thin film corresponding to the inclined face can be made small. Therefore, reflected light can be substantially projected upward
Data Source
AI summary
The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.