Multilayer Substrate Adhesion Control for Conductor Stability
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Solution Overview
Problem
Multilayer substrates with different insulating resin base material layers experience adhesion strength disparities, leading to conductor pattern peeling and positional deviations, which compromise electrical characteristics.
Innovation Solution
A manufacturing method involving conductor film-attached insulating resin base materials, where the adhesion strength of the first insulating resin base material layer to the conductor film is higher than that of the second layer, ensuring stable stacking and reduced positional deviation by thermocompression-bonding with a different base material layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If insulating resin base material layers of different materials are stacked to form a multilayer substrate, then material diversity and functional flexibility are improved, but adhesion strength disparity between layers and conductor patterns occurs, leading to peeling and positional deviation
Solution Approach 1:
The patent applies local quality by providing different insulating resin base material layers with different materials at different locations in the stacked body. Specifically, the first insulating resin base material layer has different material properties than the second layer, allowing each layer to be optimized for its specific functional requirements while maintaining overall structural integrity through controlled adhesion characteristics.
Solution Approach 2:
The patent employs parameter changes by varying the material composition and adhesion strength parameters of different insulating resin base material layers. The first layer is designed with specific adhesion strength to the conductor pattern, while the second layer has different adhesion characteristics, creating a gradient of parameters that prevents peeling and positional deviation while maintaining material diversity.
2Adaptability or versatility
If conductor patterns are disposed between insulating resin base material layers of different materials, then functional integration is improved, but peeling of conductor patterns occurs due to adhesion strength differences, compromising electrical characteristics
Solution Approach 1:
The patent applies local quality by making the insulating resin base material layers have different materials and adhesion characteristics at different locations where conductor patterns are disposed. This ensures that each conductor pattern interface has optimized adhesion properties specific to its functional requirements, preventing peeling while maintaining positioning accuracy.
Solution Approach 2:
The patent employs beforehand cushioning by designing the insulating resin base material layers with predetermined adhesion strength characteristics before conductor patterns are disposed. The first insulating resin base material layer is specifically designed with adhesion strength that prevents conductor pattern peeling during subsequent manufacturing and assembly processes, cushioning against potential failure modes in advance.
3Adaptability or versatility
If insulating resin base material layers are stacked with different materials, then design flexibility is improved, but positional deviation of conductor patterns occurs due to differential flow, reducing electrical characteristics stability
Solution Approach 1:
The patent applies local quality by assigning different material properties to different insulating resin base material layers based on their specific positions and functional requirements. This localized material differentiation allows each layer to exhibit flow characteristics appropriate for its position, preventing differential flow that would cause conductor pattern positional deviation while maintaining overall design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a multilayer substrate with reduced positional deviation and stable electrical characteristics by ensuring strong adhesion between the first insulating resin base material layer and the conductor film, preventing peeling and maintaining high electrical stability.
Implementation Method 1
an adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film
Implementation Method 2
thermocompression-bonding the first conductor film-attached insulating resin base material or the second conductor film-attached insulating resin base material and the different base material layer
Data Source
AI summary
A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.