Rigid-Flex PCB Waveguide Integration for Millimeter-Wave Packages
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Solution Overview
Problem
Traditional semiconductor device packages with external waveguides suffer from size limitations, signal degradation, and increased costs due to the need for separate PCBs, which are not suitable for high-frequency applications like automotive radar and millimeter wave systems.
Innovation Solution
A semiconductor device package incorporating a rigid-flex printed circuit board (PCB) structure that can be folded to form a compact waveguide, integrating the antenna and waveguide within the package, reducing signal path length and eliminating the need for external PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional external waveguide structures are used with separate PCBs, then assembly flexibility is maintained, but package size increases and signal degradation occurs
Solution Approach 1:
The patent merges the waveguide structure with the PCB by integrating conductive traces directly into the PCB layers, eliminating the need for separate external waveguides and reducing overall package volume while maintaining signal integrity through direct electrical connections
Solution Approach 2:
The patent transitions from three-dimensional external waveguide structures to two-dimensional planar traces embedded within PCB layers, reducing vertical height and overall package footprint while maintaining electromagnetic signal transmission capabilities
2Volume of moving object
If antenna is integrated into semiconductor device package, then overall size is reduced, but waveguide attachment complexity increases
Solution Approach 1:
The patent combines the antenna structure with the PCB by forming conductive traces directly on PCB layers, eliminating separate waveguide components and simplifying the integration process while achieving compact packaging
Solution Approach 2:
The PCB structure serves dual functions by simultaneously providing mechanical support and electrical signal transmission pathways, eliminating the need for separate waveguide attachment mechanisms and reducing assembly complexity
3Ease of manufacture
If external PCBs are used for RF coupling, then assembly flexibility is maintained, but manufacturing costs increase
Solution Approach 1:
The patent integrates RF coupling traces directly into the PCB manufacturing process, eliminating separate external PCB assemblies and reducing overall manufacturing steps while maintaining assembly flexibility through standard PCB fabrication techniques
Data Source
AI summary
A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.