Optoelectronic Sensor Modular PCB Alignment
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Solution Overview
Problem
Existing optoelectronic sensors have complex and bulky designs due to the need for precise adjustment of transmitting and receiving units, which increases manufacturing costs and reduces compactness, making them unsuitable for various applications.
Innovation Solution
The use of spacer elements within the receiving optics to maintain a consistent distance between the light receiver and the receiving optics, eliminating the need for adjustments along the optical axis and allowing for a compact, modular design that can be combined with different housings or optical elements, such as rotating mirrors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If transmitting and receiving units are adjusted in a complex manner during production, then measurement precision is improved, but device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by pre-adjusting the transmitting and receiving units to a fixed relative position during the manufacturing of the printed circuit board module. The transmitting unit and receiving unit are mounted on the same rigid area of the PCB at predetermined locations, eliminating the need for complex field adjustments. This pre-positioning ensures precise optical alignment while simplifying the overall device structure and reducing manufacturing complexity.
2Stability of the object's composition
If a housing connection is used for transmitting and receiving units, then structural stability is improved, but the chain of tolerances increases and adjustment effort increases
Solution Approach 1:
The patent merges the transmitting unit and receiving unit into a single integrated printed circuit board module. Both units are mounted on the same rigid area of the PCB, sharing a common reference frame. This integration eliminates the need for separate housing connections between the transmitting and receiving units, thereby reducing the chain of tolerances and simplifying the mechanical structure while maintaining structural stability.
3Adaptability or versatility
If transmitting and receiving units are separated into different housings, then adaptability is improved, but manufacturing precision requirements increase and production complexity increases
Solution Approach 1:
The patent segments the sensor into a modular printed circuit board module that can be independently manufactured and then integrated into different housing types. The transmitting unit and receiving unit are fabricated as a self-contained module with fixed internal alignment, which can then be adapted to various housing configurations without compromising alignment precision. This segmentation allows the core sensing module to remain precise while the external housing provides adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective, simple, and compact sensor module with reduced adjustment effort, providing stability and versatility across different sensor types while minimizing external influences like housing warping.
Implementation Method 1
A beam of light is emitted and, after reflection on an object, is received again along almost the same light path
Implementation Method 2
Distance-measuring systems also determine the time it takes light to reach the object and from this, with the help of the constant speed of light, the distance to the object
Data Source
Figure 1
Figure 2~4
Figure 5
AI summary
The sensor (10) has a light transmitter (18) provided on a printed circuit board section (16) for transmission of light bundles (38). A light receiver (22) i.e. photo-diode, is provided on another printed circuit board section (20) for receiving of reflecting light bundles (42). A receiving lens (24) comprises distance elements, via which the receiving lens is mounted on the latter circuit board section in a pre-determined position in relation to the light receiver. The distance elements are provided in form of fixing stands (26), and a LED is utilized as a light source in the transmitter. An independent claim is also included for a method for manufacturing the sensor.