Variable Thickness Buffer for Flexible Display Bending Stress
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Solution Overview
Problem
Flexible display devices face defects due to cracking of the flexible substrate and signal wiring when bent, leading to disconnection and performance issues.
Innovation Solution
A flexible display device design featuring a bending area with a first buffer member of greater thickness and a second buffer member of lesser thickness, along with supporting members, to absorb stress and prevent cracking, while maintaining structural integrity and moisture prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible substrate is bent to enable flexible display functionality, then the display device can be folded or curved for portability, but the flexible substrate and signal wiring may crack leading to disconnection and device failure
Solution Approach 1:
A buffer member is disposed on the flexible substrate at the bending area before bending occurs. This buffer member includes a first buffer portion and a second buffer portion with different thicknesses to provide beforehand cushioning that absorbs stress during bending, preventing cracks in the flexible substrate and signal wiring while maintaining reliable operation
Solution Approach 2:
The buffer member is specifically disposed at the bending area where stress concentrates during flexing. The first buffer portion has a first thickness and the second buffer portion has a second thickness different from the first, creating local quality variations that optimize stress distribution precisely where needed to prevent cracking while maintaining overall device flexibility
2Reliability
If a buffer member with varying thickness is introduced to prevent cracking, then stress distribution is improved and cracking is reduced, but the device structure becomes more complex
Solution Approach 1:
The buffer member features local quality variations with a first buffer portion and a second buffer portion having different thicknesses. This localized structural variation addresses stress concentration at specific bending areas without requiring complex structures throughout the entire device, thus improving reliability while controlling overall complexity
Solution Approach 2:
The buffer member is segmented into a first buffer portion and a second buffer portion with different thicknesses. This segmentation allows each portion to be optimized for its specific location in the bending area, providing effective crack prevention through simplified modular construction rather than a single complex structure
Data Source
AI summary
A display device includes a flexible substrate including a bending area corresponding to an area at which the display device is bent, and a first area and a second area which is spaced apart from the first area by the bending area, a display element unit disposed in the first area of the flexible substrate; and a buffer member disposed in the bending area of the flexible substrate. The buffer member in the bending area includes: a first buffer member having a first maximum thickness, and a second buffer member having a second maximum thickness which is smaller than the first maximum thickness. Among the first buffer member and the second member, the first buffer member disposed closer to the first area and the second member disposed closer to the second area.