Fluid Conductive Bead Electrical Connection for Wearables

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Solution Overview

Problem

Existing methods for providing electrical connections between flexible substrates and circuit boards in wearable electronic devices are not reliable enough to withstand deformation and require complex lithographic techniques, limiting scalability and manufacturing efficiency.

Innovation Solution

A method involving the formation of conductive traces on a flexible surface using processes like screen printing or 3D printing, followed by depositing a bead of fluid conductive material at specific locations, and aligning it with holes in a printed circuit board to create electrical connections through these holes, which also serves as a fastening mechanism, using different processes for trace and connection formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If lithographic techniques are used to form electrical connections, then manufacturing precision can be achieved, but device complexity and manufacturing cost increase significantly

Engineering Contradiction:

Improveelectrical connection precisionVSAvoidlithographic process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex lithographic processes with a mechanical pressing method. A bead of conductive material is placed on the flexible substrate, and a circuit board is pressed against it through a hole, mechanically forming the electrical connection without requiring lithography equipment or processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the state of conductive material from a deposited layer (lithography) to a bead form that can be mechanically pressed. The conductive bead is positioned and pressed through a hole in the circuit board, transforming the connection formation process from chemical/lithographic to mechanical.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If rigid connection methods are used, then electrical connection stability is improved, but flexibility and ability to withstand deformation are reduced

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidflexibility to withstand deformation

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent uses a composite structure combining a flexible substrate with conductive material beads and a circuit board. The conductive beads act as flexible connectors that can deform with the substrate while maintaining electrical contact, creating a composite connection system that is both reliable and flexible.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent creates a dynamic connection system where the conductive beads can deform elastically with the flexible substrate. The connection adapts to deformation rather than being rigid, allowing the system to maintain electrical connectivity under various mechanical conditions.

Inventive Principle:

Principle #15Dynamics

3Adaptability or versatility

If separate processes are used for trace formation and connection formation, then manufacturing flexibility is improved, but productivity decreases due to multiple steps

Engineering Contradiction:

Improvemanufacturing process flexibilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges the connection formation process with the circuit board assembly process. The conductive beads are placed on the substrate, and the circuit board is pressed against them in a single operation that simultaneously creates the electrical connection and assembles the components, eliminating separate connection formation steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method provides reliable electrical connections that can withstand deformation, reduces the need for lithographic techniques, and enables efficient, scalable manufacturing by using the same material for both conductive traces and connections, improving adhesive properties and fastening the circuit board to the flexible surface.

Implementation Method 1

pushing the printed circuit board towards the flexible surface so as to force the bead of fluid conductive material through the hole

Methodology Applied

Scientific EffectFluid flow through pressure: Pressure Gradient

Implementation Method 2

curing the fluid conductive material to provide a fastening between the at least one printed circuit board and the flexible material

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3606296B1A method for providing electrical connections

Publication Date: 2023.02.08 NOKIA TECHNOLOGIES OY

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AI summary

This application relates to a method and apparatus formed using the method. The method comprises using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also comprises positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board.