Wiring Board Buried Patterns Low Dielectric Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring boards face challenges in achieving excellent wiring followability and suppressing wiring distortion, particularly due to high frequency transmission losses associated with high dielectric constants and loss tangents in insulation materials used in communication equipment.
Innovation Solution
A wiring board design featuring buried wiring patterns with a region between patterns having an elastic modulus of 140° C. equal to or less than 0.1 MPa and a dielectric loss tangent of 0.006, utilizing a thermoplastic liquid crystal polymer resin layer with specific constitutional units and a compound having a lower melting point, along with a manufacturing method involving a resin substrate with controlled elastic modulus and heating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional insulation materials with high dielectric constant are used to reduce transmission loss, then transmission loss is suppressed, but wiring followability deteriorates due to high elastic modulus
Solution Approach 1:
The patent changes the elastic modulus parameter of the insulation material by using a thermoplastic polymer that exhibits temperature-dependent mechanical properties. At room temperature, the material maintains high elastic modulus for structural stability, while at processing temperatures it becomes soft and deformable, enabling wiring patterns to be formed without distortion. This parameter change resolves the contradiction between maintaining wiring followability and suppressing transmission loss.
Solution Approach 2:
The patent employs a composite structure consisting of a thermoplastic polymer matrix combined with specific additives or fillers that provide both low dielectric loss and appropriate mechanical properties. The composite material achieves a balance between the required electrical performance (low transmission loss) and mechanical performance (wiring followability through controlled elasticity) that neither component could achieve alone.
2Stability of the object's composition
If high elastic modulus material is used to maintain structural stability, then structural stability is improved, but wiring distortion increases during high-frequency signal transmission
Solution Approach 1:
The patent applies a dynamic approach by using a material whose elastic modulus changes with temperature. During the wiring formation process, the material is heated to become soft and deformable, allowing precise wiring patterns to be created without distortion. After cooling, the material regains its high elastic modulus to maintain structural stability during high-frequency signal transmission. This dynamic property resolution enables both wiring precision and structural stability.
Solution Approach 2:
The patent utilizes the phase transition of the thermoplastic polymer between solid and molten states. In the solid state at room temperature, the material provides structural stability. During processing, heating causes the material to transition to a molten state with low viscosity, enabling wiring patterns to be formed without distortion. Upon cooling, the material returns to the solid state, maintaining both structural integrity and wiring precision. This phase transition mechanism resolves the contradiction between structural stability and wiring distortion.
3Loss of energy
If thermoplastic liquid crystal polymer is used to reduce dielectric loss tangent, then transmission loss is suppressed, but manufacturing complexity increases due to specific processing requirements
Solution Approach 1:
The patent utilizes the temperature-dependent parameter changes of thermoplastic liquid crystal polymers to simplify manufacturing. By controlling the temperature parameter during processing, the material transitions between soft and rigid states, enabling easy formation of wiring patterns without requiring complex processing equipment or multiple processing steps. The inherent properties of the material at different temperatures naturally facilitate the manufacturing process while maintaining low dielectric loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent wiring followability and suppressed wiring distortion while reducing transmission losses, as evidenced by the achieved elastic modulus and dielectric loss tangent values, enhancing the performance of the wiring board in high-frequency communication equipment.
Implementation Method 1
heating the substrate with wiring patterns and the resin substrate in a superimposed state to obtain a wiring board
Implementation Method 2
the resin substrate has an elastic modulus at a heating temperature in heating in the superimposed state equal to or less than 0.1 MPa
Implementation Method 3
heating the substrate with wiring patterns and the resin substrate in a superimposed state
Data Source
AI summary
A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.