Printed Circuit Board Reinforcing Layer with Varying Width Openings
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Solution Overview
Problem
In the field of ultra-thin substrate applications, such as memory package substrates, there is a limit to thinning due to rigidity issues, which is addressed by incorporating a reinforcing layer in printed circuit boards to enhance stiffness.
Innovation Solution
A printed circuit board design featuring a reinforcing layer with multiple openings of varying widths, stacked on both surfaces of insulating layers, and additional passivation layers to improve adhesion and reliability of electrical connections, thereby enhancing the board's rigidity and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate is thinned to achieve ultra-thin dimensions, then the substrate thickness is reduced, but the rigidity deteriorates causing driving problems
Solution Approach 1:
The substrate structure is segmented into multiple functional layers including insulating layers, circuit layers, and reinforcing layers. This segmentation allows each layer to perform its specific function while collectively providing the necessary rigidity even when the overall substrate thickness is reduced to ultra-thin dimensions.
Solution Approach 2:
The substrate employs composite material construction with alternating insulating and reinforcing layers. The reinforcing layers provide structural strength and rigidity, while the insulating layers provide electrical insulation, allowing the substrate to maintain both ultra-thin thickness and sufficient rigidity through material composition rather than单纯 thickness increase.
2Strength
If a reinforcing layer is added to improve rigidity, then the rigidity is enhanced, but the substrate complexity increases
Solution Approach 1:
The reinforcing layers serve multiple functions simultaneously: they provide structural rigidity to prevent warpage, act as bonding interfaces between insulating layers, and provide surfaces for circuit layer formation. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in overall substrate complexity while achieving the desired rigidity enhancement.
3Strength
If multiple reinforcing layers are stacked to enhance rigidity, then the rigidity is significantly improved, but the manufacturing complexity increases
Solution Approach 1:
The reinforcing layers are prepared and positioned in advance during the lamination process, before final circuit patterning and component mounting. This preliminary arrangement of reinforcing layers allows for standardized manufacturing procedures and reduces the complexity of subsequent manufacturing steps, as the structural framework is already in place to guide further assembly operations.
Data Source
AI summary
The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.