Flexible Printed Circuit Board Reference Marks for Connector Alignment
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Solution Overview
Problem
Existing flexible printed circuit board (FPCB) manufacturing processes face issues with machining tolerance due to curling and misalignment during outer shape processing, leading to connector misalignment and potential short-circuits.
Innovation Solution
Incorporating a reference mark formed on the FPCB as an internal reference point during the manufacturing process, using it to guide outer shape processing instead of relying on external guide holes, thereby stabilizing the position of connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If guide holes formed outside the circuit board are used as reference points for outer shape processing, then the processing can be performed, but machining tolerance increases due to curling and misalignment
Solution Approach 1:
The reference mark is formed on the circuit board during the circuit formation process, before the outer shape processing. This preliminary action ensures that the reference mark is already positioned and fixed on the board, eliminating the need for external guide holes and preventing misalignment during subsequent processing steps.
Solution Approach 2:
The reference mark acts as an intermediary element that connects the circuit board to the outer shape processing system. By forming the reference mark directly on the board, it serves as a stable mediator for positioning and alignment, eliminating the harmful effect of using external guide holes that are prone to misalignment.
2Productivity
If external guide holes are used for outer shape processing, then processing can proceed, but connector misalignment and short-circuits occur
Solution Approach 1:
The reference mark is created during the circuit formation process, before outer shape processing begins. This preliminary action ensures accurate connector positioning is established in advance, preventing misalignment and short-circuits while maintaining processing efficiency.
3Manufacturing precision
If the FPCB is fixed during outer shape processing, then processing can be performed, but curling causes distance errors from reference points
Solution Approach 1:
The reference mark serves as a stable intermediary reference point that is formed directly on the circuit board. Even when the board curls or deforms during processing, the reference mark remains fixed relative to the board's circuit features, providing a reliable reference for positioning and eliminating distance measurement errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes process tolerance and improves production efficiency by accurately aligning connectors, reducing the likelihood of short-circuits and enhancing overall manufacturing precision.
Implementation Method 1
a copper plating step of plating an inner wall of the hole by using copper
Implementation Method 2
a complete bonding step of completely bonding the temporarily bonded coverlay to the base film by applying high temperature and high pressure
Data Source
AI summary
A method for manufacturing a flexible printed circuit board (FPCB) may include a cutting step of cutting a base film including an insulation layer and a copper layer into a panel shape to a predetermined standard, a drilling step of processing a hole passing through all of the insulation layer and the copper layer of the base film, a copper plating step of plating an inner wall of the hole, a circuit and reference mark forming step of forming a predetermined circuit pattern and a reference mark on the copper layer of the base film, a temporary bonding step of temporarily bonding a coverlay to a predetermined area of a top surface of the copper layer on which the circuit and the reference mark are formed, and a complete bonding step of completely bonding the temporarily bonded coverlay to the base film by applying high temperature and high pressure.