Flexible Circuit Board Stiffener Alignment via Shadow Mark
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Solution Overview
Problem
Flexible printed circuits with warpage are difficult to insert into connectors due to their lack of stiffness, hindering rapid assembly of printed circuit boards in electrical products.
Innovation Solution
A flexible circuit board design featuring a flexible light-permeable carrier with a stiffener, where an opaque mark on the top surface creates a shadow mark on the bottom, allowing for accurate alignment and adherence of the stiffener, thereby enhancing stiffness and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flexible printed circuit is made flexible for easy insertion, then ease of operation is improved, but structural stability deteriorates causing warpage
Solution Approach 1:
The patent applies local quality by providing a stiffener only in the connector insertion area rather than making the entire flexible circuit rigid. This localized stiffening maintains flexibility where needed while providing structural stability where required, resolving the contradiction between ease of insertion and structural stability.
Solution Approach 2:
The flexible circuit is segmented into different functional zones: a flexible circuit portion for bending and connection, and a stiffened portion for maintaining shape during insertion. This segmentation allows different parts to have different mechanical properties, simultaneously achieving ease of operation and structural stability.
2Stability of the object's composition
If a stiffener is added to prevent warpage, then structural stability is improved, but device complexity increases
Solution Approach 1:
The patent uses a thin film stiffener that is bonded to the flexible circuit board. This thin film structure provides the necessary structural stability to prevent warpage while adding minimal complexity to the overall device design, as it integrates seamlessly with the existing flexible circuit structure.
3Measurement precision
If alignment marks are made opaque on a light-permeable carrier, then measurement precision is improved, but loss of substance increases due to light blocking
Solution Approach 1:
The alignment marks are made opaque only in the specific locations where alignment is needed, while the rest of the carrier remains light-permeable. This localized opacity provides precise alignment functionality without significantly impacting overall light transmission, resolving the contradiction between measurement precision and loss of substance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easy and rapid insertion of the flexible circuit board into connectors by improving stiffness, preventing warpage and ensuring accurate alignment of the stiffener, facilitating efficient electrical connections.
Implementation Method 1
The first mark is opaque to create a first shadow mark on the bottom surface
Data Source
AI summary
A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.