Flexible Circuit Production on Tensioned Carrier Film Frame
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Solution Overview
Problem
Existing methods for producing flexible circuit configurations face challenges in achieving high precision and reliability, particularly during the separation from rigid substrates, which can result in damage to the sensitive layer structures.
Innovation Solution
A method using a carrier film fastened on a rigid frame allows for the deposition and processing of layer structures, ensuring precise orientation and handling, with the carrier film and frame forming a stable composite that can withstand further manufacturing steps, enabling precise structuring and assembly without damaging the flexible circuit configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid substrate is used for depositing the layer structure, then high precision and stability during production are achieved, but the separation process can damage the sensitive layer structure
Solution Approach 1:
The invention separates the functions of support and final product by using a rigid frame that can be detached. The frame provides support during manufacturing, then the flexible circuit configuration is separated from the frame after production, eliminating the damage risk associated with substrate separation while maintaining manufacturing precision.
Solution Approach 2:
The rigid frame acts as an intermediary support structure during the manufacturing process. It provides the necessary rigidity for precise layer deposition and structuring, but unlike a permanent substrate, it can be easily removed after production without damaging the flexible circuit configuration.
2Manufacturing precision
If the layer structure is deposited over the entire surface including edge surfaces, then complete coverage is achieved, but extra material is produced that is not part of the final configuration
Solution Approach 1:
The invention extracts only the necessary portion of the layer structure for the final product. By depositing layers over the entire carrier film surface and then separating the finished flexible circuit configuration from the carrier film, the patent removes the excess material that was deposited on edge surfaces, reducing material waste while ensuring complete coverage where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cost-effective and reliable production of flexible circuit configurations with high precision, allowing for precise structuring and assembly without damaging the circuit, facilitating multiple processing steps and efficient separation from the frame.
Implementation Method 1
The film can advantageously be held on the frame under elastic tension, which is uniform in the film plane
Implementation Method 2
an electrically insulating polyamide layer being producible in particular by imidization
Data Source
AI summary
A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.