Workpiece Holders TRIZ Cases

Modular rails, legs, and cross members create stable portable work supports that avoid cut-through hazards and fit multiple tools.

An eccentric drive and planetary gear layout control holder speed in vacuum coating while reducing gear complexity and exposure to heat.

A triangular spout and offset fence let this foldable cutting board pour cleanly while avoiding creases, food trapping, and knife interference.

A guide groove and sewing penetration part auto-align leather and Velcro on curved seat-cover paths, reducing manual strain and misalignment.

Multi-row serrations and V-shaped recesses keep varied key blanks securely oriented for repeatable automated key cutting.

Pyramid serrations and V-shaped recesses let one clamp grip varied key blanks in a repeatable orientation for accurate automated cutting.

Multiple movable pressing elements apply even force to chord and web members, reducing truss misbuilds and structural weakness.

A rotating free jaw and size pin keep clamp pads parallel, spreading force across small parts to reduce local pressure and damage.

Segmenting the base into a stationary frame and a movable secondary unit reduces product removal time by minimizing transport distance.

A cylindrical elevation body with spaced guide rails supports a mounting table, reducing vibration and weight to improve inspection speed.

A swing-type electrode chip replacement device uses a sliding and swinging movable plate to attach or detach chips from welding machine shanks.

A pneumatic clamping device uses a single air suction circuit to hold rigid slabs on a grid-patterned worktable.

Spaced clamp assemblies in a cable holder maintain fixed orientation and prevent damage or contamination of delicate fibers during splicing and overmolding.

A portable painting and drying apparatus uses a rectangular frame to hold cabinet doors securely during finishing operations.

Shape memory alloy wires rotate an actuator arm to lock storage devices, eliminating solenoid magnetic interference.

Localized heating zones prevent premature resin hardening while dynamic support mechanisms counteract substrate warping during chip bonding.

A modular universal holding fixture uses bridge modules and passive linear actuators to reposition tooling across diverse workpiece geometries.

A susceptor support portion with radially extending arms featuring a through hole and variable widths to reduce heating influence on the substrate.

A siding tool lip engages panel edges to establish fixed reveal distances during installation.

Fastening carrier film to rigid frame prevents substrate damage during separation while maintaining manufacturing precision.

A truss setting bracket uses cradles and a locking arm to secure structural members during installation.

Eliminating adhesive layers via spray coating and direct sintering improves thermal conductivity and design freedom in electrostatic chucks.

A spring compression apparatus featuring a pivotable crown structure and laterally displaceable helix channels for secure strut engagement.

Automated stitching system positions shoe parts between jig members to execute precise seam patterns.

A siding installation gauge uses an actuating mechanism to retract a coupling portion and force a clamp toward the tool body for secure engagement.

A magnet tray stud finder detects hidden ferrous objects through magnetic attraction.

Segmented cooling units manage coolant flow across radial zones, resolving uneven temperature distribution in semiconductor stages.

Transparent kinematic fixture constrains curved optical components via six precision contact points, eliminating distortion from overconstraint.

An automated stitching system replaces manual labor by using a computing device to control a curved drive frame and jig for precise shoe part alignment.

Laser projection guides manual puck placement to reduce operator error and production time without mechanical debris interference.

A substrate support plate transfer apparatus uses a sliding mechanism to move the quartz plate within the bonding chamber.

Wedge-shaped recesses in a support structure mechanically interlock leadframes to eliminate friction-dependent clamping failures.

Segmented base recesses constrain wafers during shear separation, reducing cracking risk and improving die yield without increasing operational complexity.

An opening/closing driving device along the fabrication line actuates a common jig pallet, eliminating heavy traveling carriages to boost productivity.

A dielectric electrostatic chuck uses a hollow shaft to deliver temperature control directly to the substrate supporting plate.

A rod with a quick-release clamp holds parts between tips for optical measurement.

Retractable seating portions and a guiding mechanism clear undercut areas of curved workpieces, preventing damage and positional misalignment.

A protective seal around electrostatic chuck bonding material prevents chemical erosion and particle contamination during semiconductor processing.