Substrate Support Plate Transfer Apparatus for OLED Bonding
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Solution Overview
Problem
Conventional substrate support plates for organic light emitting displays face challenges with mechanical strength, UV transmission, and cost as they increase in size, and the replacement process is cumbersome, often requiring disassembly of the bonding chamber, which can lead to damage and increased complexity.
Innovation Solution
A substrate support plate transfer apparatus with a protection frame and sliding transfer device allows for easy and safe replacement of the substrate support plate within the bonding chamber, utilizing rollers for smooth transfer and maintaining mechanical strength and UV transmission capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the substrate support plate is increased to provide sufficient mechanical strength for large sized substrates, then the mechanical strength is improved, but the transmission capabilities of ultraviolet radiation are reduced and cost increases
Solution Approach 1:
The substrate support plate is constructed using a composite structure combining quartz layers with high mechanical strength and transparent polymer layers with high UV transmission. This composite material approach allows the plate to simultaneously achieve sufficient mechanical strength for large substrates and maintain high UV transmission capability, resolving the contradiction between strength and UV transmission.
2Strength
If the thickness of the substrate support plate is increased to provide sufficient mechanical strength, then the mechanical strength is improved, but the cost increases
Solution Approach 1:
The composite structure of quartz and transparent polymer layers allows optimization of material usage, achieving required mechanical strength without using excessive amounts of expensive quartz material throughout the entire plate thickness, thereby controlling manufacturing costs while maintaining strength.
Solution Approach 2:
The substrate support plate is segmented into multiple layers with different materials (quartz and transparent polymer) rather than using a single thick material. This segmentation allows each layer to contribute its superior properties, achieving overall strength requirements without the cost penalty of a uniformly thick expensive material plate.
3Ease of operation
If the bonding chamber is disassembled to replace the substrate support plate, then the substrate support plate replacement is enabled, but the device complexity and risk of damage increase
Solution Approach 1:
The bonding chamber is segmented into separable components, with the substrate support plate forming an independent removable module. This allows the substrate support plate to be replaced without disassembling the entire bonding chamber, reducing device complexity and minimizing damage risk during maintenance operations.
Solution Approach 2:
The substrate support plate is extracted as a separate removable component from the bonding chamber system. This extraction design enables independent replacement of the substrate support plate without affecting the integrity or requiring disassembly of the main bonding chamber structure, simplifying maintenance procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and damage-free replacement of substrate support plates, reducing maintenance complexity and allowing for the use in larger substrates while maintaining structural integrity and UV transmission, thus addressing the limitations of conventional methods.
Implementation Method 1
A UV projection device 40 disposed at the back of the substrate support plate 30 projects UV radiation through the substrate support plate 30 and the sealed glass substrate 10 to the sealing resin 13. In response, the sealing resin 13 hardens so that bonding between the device glass substrate 1 and the sealed glass substrate 10 is completed.
Data Source
AI summary
A substrate support plate transfer apparatus for fabricating an organic light emitting display is disclosed. In one embodiment, the apparatus includes a quartz plate transferred into a bonding processing chamber for an organic light emitting device, a protection frame on which the quartz plate is placed in order to transfer the quartz plate into the chamber, and a frame-shaped supporting plate including a sliding transfer device for helping the transfer of the protection frame and installed in the chamber. The quartz plate has a rigidity capable of enduring pressure in the bonding process applied to a large sized substrate, and the apparatus provides for convenient replacement of the quartz plate.