Stage Heat Exchanger With Segmented Cooling Zones
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Solution Overview
Problem
In semiconductor manufacturing, existing stages face challenges in achieving uniform temperature control of substrates due to varying coolant temperatures along the circumferential flow paths, which complicates accurate temperature management as devices miniaturize.
Innovation Solution
A stage design incorporating a heat exchanger with two-dimensionally distributed, non-inclusive heat exchange units and a flow path unit formed using 3D printing, allowing for independent temperature control of heat exchange media across the substrate, enhancing temperature uniformity and control precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant flows through concentric flow paths in the electrode, then the substrate can be cooled, but the temperature distribution of the substrate cannot be controlled uniformly due to varying coolant temperatures along the circumferential route
Solution Approach 1:
The heat exchanger is divided into multiple independent heat exchange units (first heat exchange unit, second heat exchange unit, etc.), each corresponding to different radial regions of the substrate. Each unit has its own coolant supply and discharge paths, allowing independent temperature control for different substrate regions, thus achieving uniform temperature distribution across the substrate surface.
Solution Approach 2:
Different heat exchange units are configured with different coolant flow rates and supply temperatures according to the local heat generation characteristics of substrate regions. The first heat exchange unit handles the central region while the second heat exchange unit handles the peripheral region, with each unit optimized for its specific thermal requirements to achieve uniform overall temperature control.
2Adaptability or versatility
If a single coolant reservoir controls the temperature, then the system is simple, but it cannot provide independent temperature control to multiple flow paths
Solution Approach 1:
The single coolant reservoir is segmented into multiple independent cooling circuits, each serving a specific heat exchange unit. Each circuit has its own coolant supply path and discharge path, enabling independent temperature control for different substrate regions while maintaining a relatively simple overall structure based on the modular heat exchange unit design.
3Temperature
If coolant circulates through a single concentric path, then the flow path structure is simple, but the temperature of circulating coolant varies along the route making uniform temperature control difficult
Solution Approach 1:
The single concentric flow path is segmented into multiple independent flow paths, each serving a specific heat exchange unit. Each flow path has its own supply and discharge routes, allowing the coolant temperature to be controlled uniformly within each segment while enabling different temperature settings for different radial regions of the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves temperature control accuracy and uniformity across the substrate, reducing the need for large chiller units and enabling more responsive temperature management, thus supporting the precise requirements of miniaturized semiconductor devices.
Implementation Method 1
The heat exchanger is configured to respectively supply a heat exchange medium to a plurality of two-dimensionally distributed and mutually non-inclusive regions of the rear surface of the plate and to recover the heat exchange medium thus supplied
Data Source
AI summary
A stage includes a plate and a heat exchanger. The plate has a front surface, on which a substrate is mounted, and a rear surface. The heat exchanger is configured to individually supply a heat exchange medium to a plurality of two-dimensionally distributed and mutually non-inclusive regions of the rear surface of the plate and to recover the heat exchange medium thus supplied.