Wafer Mounting Apparatus with Localized Heating and Dynamic Support
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Solution Overview
Problem
The increasing size of substrates and wafers in semiconductor production poses challenges in accurately mounting chips due to potential warping, overheating, and premature hardening of heat-hardened resins, leading to unreliable bonding and reduced bonding area efficiency.
Innovation Solution
A mounting apparatus with a holding pedestal and moving mechanism that allows for precise positioning and rotation of substrates, enabling local bonding on large substrates without overheating, and features a larger tracking area than the substrate, allowing for increased bonding density and edge-to-edge mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the entire substrate is heated to mount parts on large substrates, then the bonding area is increased, but the heat-hardened resin hardens before parts are mounted due to prolonged overheating
Solution Approach 1:
The substrate heating process is segmented into local heating zones rather than heating the entire substrate at once. The heating device heats only the area where parts are to be mounted, allowing the resin to remain workable while increasing the effective bonding area through sequential or distributed heating zones.
Solution Approach 2:
The substrate is pre-heated to a temperature below the resin's hardening point before parts are mounted. This preliminary heating softens the resin slightly to improve adhesion without causing premature hardening, allowing parts to be positioned and then bonded as the temperature is gradually increased.
2Area of stationary object
If the substrate area is increased to reduce production cost, then more parts can be mounted per substrate, but warps and flexures form due to weight and atmospheric conditions
Solution Approach 1:
Support structures or counterweights are introduced to balance the gravitational effect on large substrates. These supports are positioned to counteract warping forces, maintaining substrate flatness throughout the mounting process despite the increased substrate area and weight.
Solution Approach 2:
The substrate handling system incorporates dynamic adjustment mechanisms that can adapt to substrate warping in real-time. These mechanisms allow the mounting apparatus to compensate for flexures and maintain precise positioning accuracy even as substrate conditions change during the mounting process.
3Productivity
If parts are mounted on large substrates with increased bonding area, then production efficiency is improved, but mounting precision decreases due to substrate warping
Solution Approach 1:
Sensors and detection systems continuously monitor substrate position and warping during the mounting process. This feedback information is used by the control system to dynamically adjust the positioning of parts and the movement of the mounting head, maintaining high precision despite substrate deformation on large-area substrates.
Solution Approach 2:
The mounting system incorporates movement along multiple axes and dimensions to compensate for substrate warping. By operating in three-dimensional space with adjustable degrees of freedom, the system can maintain precise part placement accuracy even when the substrate surface is not perfectly flat.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and efficient mounting of chips on large substrates with reduced risk of warping and overheating, maintaining bonding quality and increasing the bonding area across the entire substrate surface.
Implementation Method 1
a bonding stage, which suction-holds a substrate
Implementation Method 2
the chip is mounted on the substrate while the chip and the substrate are being heated and pressed
Data Source
AI summary
The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.