Wafer Debonding Apparatus Using Shear Force and Vacuum Chuck

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Solution Overview

Problem

Current wafer debonding methods face challenges in efficiently separating wafers from carrier plates without causing damage, especially when the carrier plate is larger than the wafer, as existing techniques can be costly, difficult to coordinate, and may result in wafer cracking or incomplete separation.

Innovation Solution

A debonding apparatus and method that utilize a base with a recess and a paddle with guiding features to apply a shear force to the carrier plate while inhibiting the wafer from moving, and a vacuum chuck with distributed suction to separate the wafer from the carrier plate, allowing for controlled separation and reduced risk of damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional debonding methods are used to separate wafers from carrier plates, then the separation process can be completed, but the risk of wafer damage increases and operational complexity increases

Engineering Contradiction:

Improvewafer integrityVSAvoiddebonding process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The debonding apparatus is divided into distinct functional segments: a base with recesses to hold the wafer, a separate paddle component for applying shear force, and a vacuum chuck system. This segmentation allows each component to perform its specific function independently, reducing overall system complexity while maintaining reliability through coordinated operation of simple, dedicated parts.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The paddle acts as an intermediary tool that transfers shear force from the operator to the carrier plate without directly contacting the wafer. This intermediate component protects the wafer from direct mechanical contact that could cause damage, while still enabling effective debonding through controlled shear force application to the plate-adhesive interface.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If shear force is applied to separate the wafer from the plate, then separation efficiency improves, but the risk of wafer cracking increases

Engineering Contradiction:

Improvedebonding efficiencyVSAvoidwafer cracking

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The base includes recesses that locally contain the wafer at specific positions, providing localized support and constraint. This local quality approach allows shear force to be applied to the carrier plate while the wafer remains protected in its recess, enabling efficient debonding without subjecting the entire wafer to harmful mechanical stress.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Instead of applying force directly to the wafer to separate it from the plate, the method inverts the approach by applying shear force to the carrier plate while the wafer is held stationary in the recess. This inversion protects the wafer from direct force application while achieving the same separation objective through plate displacement.

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of operation

If the carrier plate is larger than the wafer, then handling is facilitated, but incomplete separation and operational difficulty increase

Engineering Contradiction:

Improvewafer handlingVSAvoidcoordination difficulty

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The base is pre-configured with recesses sized to accommodate the wafer, and the paddle is pre-shaped with engagement features for the carrier plate. This preliminary preparation of the apparatus allows the operator to simply place the wafer-plate assembly into the recess and push the paddle, eliminating complex coordination steps while maintaining ease of handling for oversized plates.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The base with its recess serves multiple functions: it holds the wafer during debonding, provides a stable platform for the operation, and guides the paddle movement. This multi-functionality reduces the need for additional specialized components, simplifying the overall apparatus while maintaining ease of operation for various plate sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient and controlled separation of wafers from carrier plates, reducing the risk of damage and improving the yield of good dies, while also simplifying the debonding process and reducing operational complexity.

Implementation Method 1

a vacuum chuck with distributed suction to separate the wafer from the carrier plate

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Implementation Method 2

apply a shear force to the carrier plate while inhibiting the wafer from moving

Methodology Applied

Scientific EffectShear force: Shear Stress

Data Source

PatentUS9799507B2Devices and methodologies to clean wafers with solvent

Publication Date: 2017.10.24 SKYWORKS SOLUTIONS INC

AI summary

Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed.