Flexible Circuit Board Thermoforming for Consistent Bending Radii

The patent applies parameter changes by heating the flexible printed circuit board to a specific temperature range (80-120°C) to make the substrate pliable, then rapidly forming it to the desired shape. This thermal parameter change allows the material to be formed quickly without requiring long pressure holding times, thus improving productivity while maintaining bending precision through controlled thermal conditions

The patent replaces the traditional mechanical molding method with a thermo-forming approach. Instead of using cold molding with prolonged pressure, the system uses heated forming rollers that combine thermal energy with mechanical pressure to achieve rapid shaping. This substitution of mechanical cold-forming with thermal-mechanical forming reduces processing time significantly

The patent uses parameter changes in two stages: first heating the FPCB to 80-120°C to make it pliable for forming, then rapidly cooling it after forming to lock in the desired shape. This thermal parameter cycling ensures both precise bending radius control during forming and stable shape retention after cooling, preventing the board from resuming its original shape

The patent exploits phase transitions of the flexible printed circuit board material through controlled heating and cooling. By heating above the glass transition temperature range and then rapidly cooling, the material undergoes a phase transition that locks in the formed shape, ensuring long-term shape stability and preventing elastic recovery to the original flat state