Flexible Circuit Through Contacts via Unstructured Carrier Film

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Solution Overview

Problem

Existing methods for producing flexible circuit configurations face challenges in creating very small structures cost-effectively while maintaining flexibility and preventing alignment and distortion issues, leading to potential malfunctions in electrical connections.

Innovation Solution

A method involving the connection of an unstructured carrier film to the layer sequence, followed by structuring and creating through contacts using the carrier film, which allows for precise and cost-effective production of flexible circuits with improved handling capabilities and reduced flaws in connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pre-structuring of the carrier film is used, then alignment precision may be improved, but orientation errors and distortions occur during handling leading to connection flaws

Engineering Contradiction:

Improvealignment precisionVSAvoidconnection reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

Instead of pre-structuring the carrier film and then connecting it (which causes alignment errors), the patent inverts the sequence: first connect the unstructured carrier film to the layer sequence, then create the structures and through contacts through the connected carrier film. This eliminates orientation errors and distortion issues while maintaining manufacturing precision.

Inventive Principle:

Principle #13The other way round (Inversion)

2Manufacturing precision

If very small structures are created, then manufacturing precision is improved, but cost-effectiveness deteriorates

Engineering Contradiction:

Improvestructure size precisionVSAvoidcost-effectiveness

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The carrier film is connected to the layer sequence in advance (preliminary action) before creating the very small structures and through contacts. This preliminary connection provides a stable base that enables precise structuring while maintaining cost-effectiveness through simplified process control and high-precision executable steps.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If the layer sequence is made flexible, then adaptability is improved, but handling capability deteriorates

Engineering Contradiction:

ImproveflexibilityVSAvoidhandling capability

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

The unstructured carrier film acts as an intermediary that connects to the flexible layer sequence. This carrier film provides improved handling capability during further use while the layer sequence maintains its flexibility for the application. The carrier film serves as a mediator that enables both flexibility and ease of handling.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS9027240B2Method for producing a flexible circuit configuration

Publication Date: 2015.05.12 CICOR MANAGEMENT

AI summary

For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.