Flexible Coil Substrate Layout for High-Voltage Phase Isolation
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Solution Overview
Problem
Existing coil substrates for motors face challenges in maintaining adequate inter-wiring distances between adjacent coils of different phases, which can lead to short circuits when high voltages are applied, particularly when wound into a cylindrical shape.
Innovation Solution
A coil substrate design featuring a flexible substrate with coils formed on both surfaces, where the inter-wiring distance between coils of different phases is intentionally larger than the inter-wiring distances within each coil, ensuring that wirings do not come into contact when wound into a cylindrical shape, thereby preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If coils of different phases are arranged adjacent to each other on a flexible substrate, then the device complexity is reduced and manufacturing is simplified, but the inter-wiring distance between adjacent coils becomes insufficient leading to short circuits under high voltage
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional cylindrical arrangement by winding the flexible substrate. This dimensional change allows adjacent coils to be spatially separated in the radial direction while maintaining electrical connectivity, thereby increasing the inter-wiring distance between different phase coils and preventing short circuits under high voltage conditions.
Solution Approach 2:
The patent modifies the geometric parameters of the coil substrate by controlling the winding radius and pitch during the cylindrical winding process. By optimizing these parameters, sufficient radial clearance is created between adjacent coils, ensuring adequate inter-wiring distance while maintaining the compact structure needed for motor applications.
2Reliability
If the inter-wiring distance between adjacent coils is increased to prevent short circuits, then the reliability improves, but the area occupied by the coil substrate increases
Solution Approach 1:
The patent utilizes the third dimension (radial direction) to achieve coil separation, allowing sufficient inter-wiring distance without increasing the planar footprint. The cylindrical winding configuration enables compact area utilization while maintaining reliable electrical isolation between adjacent coils through radial spacing.
Solution Approach 2:
The patent employs a nested cylindrical winding structure where multiple coil turns are arranged concentrically. This nesting approach allows efficient space utilization by stacking coils in the radial direction, achieving both compact area occupation and adequate inter-wiring distance for high voltage reliability.
Data Source
AI summary
A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that each of the coils includes wirings formed on the first surface of the flexible substrate and wirings formed on the second surface of the flexible substrate. The coils include an N-th coil forming an N-th phase and an (N+1)-th coil formed adjacent to the N-th coil and forming an (N+1)-th phase different from the N-th phase, and each coil is formed such that an inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the N-th coil, and the inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the (N+1)-th coil.