Flexible Coil Substrate Lamination for Motor Efficiency
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Solution Overview
Problem
Existing electric motor technologies face challenges in efficiently stacking coils with high positional accuracy and increasing the space factor, as thin wire coils are difficult to wind and prone to breakage, and existing methods struggle to enhance the space factor and accuracy of coil stacking.
Innovation Solution
A coil substrate with a flexible substrate and coils formed using printed wiring board technology, featuring cuts and folding lines that allow for the formation of a laminated coil substrate by folding the substrate, which increases the space factor and reduces conductor resistance, enabling high-efficiency motor construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thin wire coils are used to form single coils, then the motor can be constructed with traditional winding methods, but the coils are difficult to wind and prone to breakage, reducing manufacturing reliability
Solution Approach 1:
The patent replaces the mechanical winding process with a printed circuit board fabrication process. Coils are formed by depositing conductive material patterns on flexible substrates using standard PCB techniques (etching, plating, or printing) rather than manually or mechanically winding thin wires. This substitution eliminates the difficulty of winding and breakage issues while maintaining coil functionality.
Solution Approach 2:
The patent uses composite flexible substrates (such as polyimide or polyester films) combined with conductive materials (copper foil, conductive ink, or plated copper) to create coil structures. This composite approach provides both the flexibility needed for folding and the electrical conductivity needed for coil operation, while the substrate protects the conductive material from breakage.
2Manufacturing precision
If traditional coil stacking methods are used, then coils can be assembled, but the positional accuracy and space factor are insufficient
Solution Approach 1:
The patent divides the motor structure into modular segments: flexible substrates with pre-formed coils are created as separate modules, then stacked and bonded together in precise sequences. Each substrate layer acts as an independent module with precisely positioned coils, enabling high positional accuracy in the final stacked assembly while optimizing space utilization.
Solution Approach 2:
The patent transitions from planar coil arrangements to three-dimensional stacked configurations. By folding flexible substrates and stacking multiple layers in the vertical dimension, the design achieves higher positional accuracy and increases the space factor by utilizing vertical space rather than only horizontal space.
3Loss of energy
If flexible substrates with cuts are folded to form laminated coil substrates, then the space factor increases and conductor resistance decreases, but the substrate structure becomes more complex
Solution Approach 1:
The patent employs thin flexible substrate films (polyimide or polyester) that can be easily cut, folded, and laminated. These thin films reduce conductor path lengths when folded into three-dimensional configurations, decreasing conductor resistance and energy losses, while their flexibility allows complex folding patterns to be implemented using standard fabrication techniques.
Data Source
AI summary
A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.