Flexible Connector Rigidity Element Prevents Warping
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Solution Overview
Problem
Conventional flexible connectors for electronic devices often warp during the crimping process, leading to failures such as cracking of the passivation layer on IC chips and short circuits due to trapped foreign matter, which limits the usable substrate area for electronic components.
Innovation Solution
A flexible connector design featuring a rigidity element between through holes and pads, coupled with wiring, to prevent warping during the crimping process, thereby reducing the likelihood of failures and increasing substrate area utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the flexible connector is crimped to the IC chip during assembly, then the IC chip is mounted to the flexible connector, but the force exerted causes layers within the flexible connector to warp, resulting in cracking of the passivation layer and short circuits
Solution Approach 1:
The rigidity reinforcing pattern is formed on the flexible connector before the IC chip mounting process. This preliminary structural preparation prevents warping during crimping by providing pre-established rigidity in the IC area, eliminating the need for corrective actions during assembly and ensuring reliable mounting without passivation layer cracking or short circuits.
2Area of stationary object
If the IC chip is disposed on the substrate, then the substrate area for electronic components is limited, but moving the IC chip to a flexible connector increases substrate area utilization
Solution Approach 1:
The flexible connector is divided into distinct functional areas: a first area for connecting to the substrate and a second IC area for mounting the IC chip. The rigidity reinforcing pattern is specifically applied to the IC area, segmenting the structural requirements of different zones. This allows the substrate area to be maximized while the IC area receives targeted rigidity support to prevent warping during mounting.
Solution Approach 2:
The rigidity reinforcing pattern is applied locally to the IC area of the flexible connector rather than uniformly across the entire connector. This local quality enhancement provides the necessary rigidity where the IC chip mounting occurs, preventing warping and reliability issues, while maintaining flexibility in other areas and maximizing the usable substrate area.
3Reliability
If the flexible connector layers warp during crimping, then foreign matter may be trapped between the IC chip and flexible connector, but preventing warping requires additional structural elements
Solution Approach 1:
The flexible connector structure serves itself by incorporating the rigidity reinforcing pattern made from the same conductive material as the existing wiring. This self-service approach provides the necessary structural support without requiring separate external reinforcement elements, maintaining electrical functionality while preventing warping during the crimping process to avoid foreign matter entrapment.
Data Source
AI summary
A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.