Flexible Display Bonding via Anisotropic Conductive Film
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Solution Overview
Problem
Existing methods for manufacturing flexible display devices face challenges in ensuring reliable electrical connections and display quality due to issues with the bonding between integrated circuit chips and display panels, as well as between flexible circuit boards and display panels.
Innovation Solution
A method involving a flexible substrate with a bonding structure, an anisotropic conductive film, and a driving circuit, where the anisotropic conductive film is cured at a temperature between 140°C and 165°C to enhance bonding and reduce peeling at interfaces, thereby improving electrical connections and display reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to connect integrated circuit chips and flexible circuit boards to display panels, then manufacturing process is simple, but electrical connection reliability deteriorates and peeling occurs at interfaces
Solution Approach 1:
An anisotropic conductive film is introduced as an intermediary bonding layer between the flexible substrate and the driving circuit. This film contains conductive particles embedded in an adhesive layer, providing both mechanical bonding and electrical connection functions. The film prevents direct contact between the flexible substrate and circuit components, eliminating peeling issues while maintaining electrical reliability through its unique anisotropic conductivity properties.
Solution Approach 2:
The bonding structure uses a composite anisotropic conductive film comprising an adhesive layer with embedded conductive particles. This composite material combines the adhesive properties of the polymer matrix with the electrical conductivity of metal particles, achieving both mechanical bonding strength and electrical connection in a single layer, thereby improving reliability without significantly increasing process complexity.
2Strength
If high temperature bonding is used to ensure strong adhesion, then bonding strength improves, but flexible substrate deformation and display quality deteriorate
Solution Approach 1:
The bonding process parameters are optimized to use a moderate temperature range (80-150°C) instead of conventional high temperature bonding. The anisotropic conductive film's adhesive layer is formulated to achieve sufficient bonding strength within this lower temperature range, preventing flexible substrate deformation and maintaining display quality while still providing strong adhesion between components.
3Reliability
If conventional isotropic conductive adhesive is used, then electrical connection is achieved, but peeling occurs at bonding interfaces reducing reliability
Solution Approach 1:
The anisotropic conductive film serves as a mediator that prevents direct bonding between the flexible substrate and driving circuit, eliminating the peeling issue. The film's structure with conductive particles suspended in an adhesive matrix allows it to bond to both surfaces independently, distributing stress evenly and preventing interface delamination that occurs with conventional isotropic conductive adhesives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces peeling at interfaces and enhances the reliability and quality of electrical connections, leading to improved display performance and reliability of flexible display devices.
Implementation Method 1
the anisotropic conductive film is cured, wherein a bonding temperature of the anisotropic conductive film is greater than or equal to 140° C. and less than or equal to 165° C.
Implementation Method 2
the anisotropic conductive film is cured, wherein a bonding temperature of the anisotropic conductive film is greater than or equal to 140° C. and less than or equal to 165° C.
Data Source
AI summary
The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.