Flexible Display Wiring Layout With Organic Stress Buffering

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Solution Overview

Problem

The existing display apparatuses face challenges in reducing defects such as short-circuits and broken wiring, particularly when bent, due to high tensile stress on conductive lines during the bending process.

Innovation Solution

The display apparatus incorporates a substrate with a bending area where an organic material layer covers internal and external conductive lines, and organic through-holes connect these lines, allowing for reduced tensile stress absorption and minimizing defects by using an organic material layer with a high elongation percentage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the substrate is bent to enhance visibility or decrease size, then the display apparatus achieves better viewing angles or compact form, but high tensile stress occurs on conductive lines causing defects such as broken wiring and short-circuits

Engineering Contradiction:
Improvebending capabilityVSAvoidconductive line integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

An organic material layer with high elongation percentage is introduced between the substrate and the conductive lines before bending occurs. This layer acts as a cushion that absorbs and distributes the tensile stress generated during bending, preventing the stress from concentrating on the conductive lines and causing breaks or short-circuits.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent changes the mechanical parameter of the organic material layer by selecting materials with high elongation percentages. This parameter change allows the material to stretch significantly during bending without breaking, thereby absorbing tensile stress and protecting the conductive lines from damage.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If organic material layer with high elongation percentage is used to absorb tensile stress, then defect occurrence is reduced, but the interval between conductive lines must be carefully controlled

Engineering Contradiction:
Improvedefect reductionVSAvoidconductive line spacing
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies different properties to different regions: the organic material layer has high elongation percentage specifically in the bending area to absorb tensile stress, while the conductive lines maintain their electrical conductivity and structural integrity. This local differentiation of material properties allows the system to simultaneously achieve defect reduction and maintain manufacturing precision.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the occurrence of defects like short-circuits and broken wiring by distributing tensile stress across the organic material layer, enhancing the reliability and efficiency of electrical signal transfer in bent display apparatuses.

Implementation Method 1

an organic material layer with a high elongation percentage

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS11889731B2Display apparatus
Publication Date: 2024.01.30 SAMSUNG DISPLAY CO LTD
  • US11889731B2 patent drawing
  • US11889731B2 patent drawing
  • US11889731B2 patent drawing

AI summary

A display apparatus includes: a substrate having a bending area between a first area and a second area; internal conductive lines on the substrate in the first area; external conductive lines on the substrate in the second area; an organic material layer covering the bending area and covering at least a portion of the internal conductive lines and the external conductive lines; and connection lines on the organic material layer and connecting the internal conductive lines to the external conductive lines, respectively. Organic through-holes are defined through the organic material layer, the connection lines are respectively connected to the internal conductive lines through the organic through-holes, and an upper surface of the organic material layer between the organic through-holes has a convex curved shape.