Flexible Display Support Films for Precision Circuit Mounting
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Solution Overview
Problem
Manufacturing thin-type display devices without a support base material poses challenges in mounting flexible printed substrates with circuit elements, requiring high precision and potentially lowering mounting yield due to increased signal complexity.
Innovation Solution
A display device structure with a flexible substrate, integrated circuit elements, and a unique adhesive and support film configuration that allows internal mounting of drive elements without a flexible printed substrate, using thermally conductive and insulative materials to secure components and prevent heat damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a flexible printed substrate is used to mount circuit elements on a thin-type display device without a support base material, then the device can achieve thinness and flexibility, but mounting precision becomes extremely difficult to control and signal complexity increases
Solution Approach 1:
The patent divides the mounting structure into separate support films (first support film 201 and second support film 203) positioned on opposite sides of the flexible substrate 110. This segmentation provides independent support for the display part 120 and mounting part 140, enabling precise mounting of circuit elements without requiring the entire flexible substrate to maintain high precision during assembly.
Solution Approach 2:
The patent employs composite material structures including support films made of polyester or polyimide with specific thermal conductivity properties (0.2-2.0 W/mK). These support films are combined with adhesive layers having controlled thermal conductivity (0.1-1.0 W/mK) to create a composite mounting structure that provides both mechanical support and thermal management, enabling reliable circuit element mounting on flexible substrates.
2Device complexity
If circuit elements are mounted directly on the flexible substrate without a support base material, then the device structure is simplified, but heat from circuit elements can damage organic EL display elements
Solution Approach 1:
The patent applies different thermal conductivity properties to different regions and layers of the mounting structure. The adhesive layer 193 between the flexible substrate and circuit elements has low thermal conductivity (0.1-1.0 W/mK) to insulate the organic EL elements from heat. Meanwhile, the support films have controlled thermal conductivity (0.2-2.0 W/mK) to provide structural support while managing heat distribution locally where needed.
Solution Approach 2:
The patent introduces adhesive layers (191, 193) and support films (201, 203) as intermediary structures between the circuit elements and the organic EL display elements. These intermediaries serve dual functions: mechanically securing the circuit elements to the flexible substrate while thermally insulating the sensitive display elements from heat generated by the circuit elements.
3Manufacturing precision
If high precision mounting technology is used to mount flexible printed substrates with circuit elements, then mounting accuracy improves, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent incorporates support films (201, 203) and adhesive layers (191, 193) into the display device structure before circuit element mounting. These pre-installed components provide a stable, precision-ready platform that simplifies the subsequent circuit element mounting process, eliminating the need for complex high-precision mounting operations on the flexible substrate itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable mounting of circuit elements without high precision technology, increasing yield and protecting organic EL elements from heat damage, while allowing the display device to be bent and powered externally.
Implementation Method 1
a first adhesive layer arranged above the second surface of the substrate and arranged opposing the display part and the frame part, a first support film above the first adhesive layer, a second adhesive layer arranged above the second surface of the substrate and arranged opposing the mounting part
Implementation Method 2
using thermally conductive and insulative materials to secure components and prevent heat damage
Implementation Method 3
using thermally conductive and insulative materials to secure components and prevent heat damage
Data Source
AI summary
A display device includes a substrate having flexibility, a first surface and a second surface opposing the first surface, a display part arranged with a plurality of pixels above the first surface of the substrate, a frame part having a drive element for driving the plurality of pixels arranged around the display part, a mounting part mounted above the first surface of the substrate and including an individual circuit element and a connection element, a first adhesive layer above the second surface of the substrate and opposing the display part and the frame part, a first support film above the first adhesive layer, a second adhesive layer above the second surface of the substrate and opposing the mounting part, and a second support film above the second adhesive layer, wherein the first adhesive layer and the first support film separated from the second adhesive layer and the second support film.