Flexible Display Wire Changing Layer Through Hole Elimination
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Solution Overview
Problem
The first wire changing layer in flexible folding active matrix AMOLED display panels is prone to breaking and shorting due to stress and etching residue, particularly at the edges of through holes with protrusions in the organic insulation layer.
Innovation Solution
A display panel design where the first wire changing layer is positioned on the surface of the organic insulation layer and extends to the combination insulation layer, eliminating through holes in the organic insulation layer, and featuring edge lines with square, sawtooth, triangular, or sinusoidal waveforms to prevent shorting and improve stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed in the organic insulation layer to connect wire layers, then electrical connectivity between layers is achieved, but wire breakage and shorting occur due to protrusions and etching residue at the through hole edges
Solution Approach 1:
The patent applies preliminary action by forming a planarization layer before the wire changing layer to pre-compensate for the protrusion problem. The planarization layer is deposited to fill and smooth the surface irregularities created by the through holes in the organic insulation layer, ensuring a flat surface for subsequent wire layer formation. This prevents etching residue and protrusions from causing wire breakage or shorting in later processing steps.
2Device complexity
If the first wire changing layer is positioned on the organic insulation layer surface, then manufacturing complexity is reduced, but wire breakage occurs due to stress and protrusions at through hole edges
Solution Approach 1:
The planarization layer is formed in advance to create a flat, stress-distributing surface before the wire changing layer is deposited. This preliminary structural preparation eliminates the need for complex through-hole avoidance designs while providing mechanical support that prevents wire breakage during subsequent processing and device operation.
3Productivity
If multiple through holes are formed in the organic insulation layer for wire connections, then electrical connectivity is achieved, but manufacturing yield decreases due to wire breakage and shorting
Solution Approach 1:
By forming the planarization layer before creating the wire changing layer, the patent eliminates the harmful effects of through hole protrusions and etching residue. This preliminary surface preparation allows through holes to be formed without causing wire breakage or shorting, thereby improving manufacturing yield while maintaining wire integrity.
Data Source
AI summary
The present invention provides a display panel and a manufacturing method thereof. The display panel includes a flexible substrate, a buffer layer, a combination insulation layer, recess, an organic insulation layer, and a first wire changing layer. The first wire changing layer is disposed on an upper surface of the organic insulation layer and extends to the combination insulation layer. The present invention removes a through hole in a conventional organic insulation layer, on one hand mitigates the issue of broken lines in the first wire changing layer, and on the other hand mitigates the issue of shorting of adjacent two of wires in the first wire changing layer because of square waveform, sawtooth waveform, triangular waveform, and sinusoidal waveform of an edge line on a side of the first wire changing layer such that stability of the display panel is improved.