Flexible Display Wiring on Uneven Under Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flexible display devices require a larger area for non-linear wiring configurations to maintain bending resistance, which increases the necessary area for the same number of wirings compared to linear configurations.
Innovation Solution
A display device with a bendable area featuring an under layer with flexibility and connection wiring that extends from the pixel array to the connection terminal, where the upper surface of the under layer has an uneven shape causing the connection wiring to repeatedly turn, allowing for a more compact layout while maintaining desired bending resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring which looks non-linear in a plan view is provided to improve bending resistance, then the resistance with respect to bending is improved, but the area necessary for one wiring in a plan view increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar wiring layout to a three-dimensional configuration using an uneven under layer surface. The connection wiring is formed on an under layer whose upper surface has an uneven shape with repeated protrusions and recesses, causing the wiring to repeatedly turn in directions of the thickness of the under layer. This vertical dimension utilization allows the wiring to achieve non-linear bending resistance without increasing the planar area footprint, as the wiring path extends in the thickness direction rather than spreading out horizontally.
Solution Approach 2:
The patent implements nesting by embedding the connection wiring within the three-dimensional structure of the under layer. The wiring is nested on the uneven surface created by repeated protrusions and recesses, allowing it to follow a complex three-dimensional path while remaining contained within the vertical space of the under layer thickness. This nesting approach enables the wiring to achieve extended effective length for bending resistance without occupying additional planar area.
2Area of stationary object
If wirings are formed to be linear to reduce area, then the area necessary to provide wirings is reduced, but the resistance with respect to bending decreases
Solution Approach 1:
The patent applies curvature by creating an uneven under layer surface with repeated protrusions and recesses, causing the connection wiring to follow a curved three-dimensional path rather than a straight line. The wiring repeatedly turns in directions of the thickness of the under layer, creating a serpentine or wave-like configuration that provides bending resistance while maintaining a compact planar footprint. This curvature in the vertical dimension compensates for the reduced planar area.
Solution Approach 2:
The patent changes the geometric parameters of the under layer by creating an uneven surface with controlled protrusions and recesses. By modifying the surface topology from flat to uneven, the effective path length of the wiring in the thickness direction is increased, thereby enhancing bending resistance without increasing the planar area. The parameter change involves the vertical displacement and curvature radius of the under layer surface features.
Data Source
AI summary
A display device according to an embodiment of the present invention includes: a display area provided with a pixel array part; a terminal area arranged on a backside of the display area and provided with a connection terminal to which a signal is supplied from outside; and a bendable area to connect the display area and the terminal area, wherein the display device is provided with, in the bendable area, an under layer having flexibility, and a connection wiring which is provided on the under layer and extends from a side of the pixel array part to a side of the connection terminal, and an upper surface of the under layer has an uneven shape so that the connection wiring repeatedly turns in directions of a thickness of the under layer.