Flexible Embedded Die Package Without Through-Silicon Vias
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Solution Overview
Problem
Embedded die technology faces challenges due to manufacturing yield and supply chain maturity issues, and conventional packaging methods restrict the placement of passive components near active components due to heat dissipation issues, leading to increased costs and size limitations.
Innovation Solution
A flexible substrate embedded die package is created using a multi-layer flexible substrate with micro-via interconnections, a semiconductor die attached with an adhesive, and a dielectric bonding film for hermetic sealing, eliminating the need for through silicon vias and allowing passive components to be assembled directly over the die, thereby reducing package thickness and enhancing thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging methods are used with substrate as interposer, then device package size is larger, but manufacturing cost and supply chain complexity are reduced
Solution Approach 1:
The patent merges the substrate and die into a single integrated structure where the die is directly embedded within the flexible substrate layers. This eliminates the need for separate interposer substrates and reduces supply chain steps by combining multiple components into one manufacturing process.
Solution Approach 2:
The die is embedded into the flexible substrate during the substrate manufacturing process itself, before final device assembly. This preliminary integration action eliminates subsequent packaging steps and reduces supply chain complexity while achieving miniaturization.
2Quantity of substance
If passive components are placed near active component in conventional package, then I/O density is reduced, but heat dissipation is improved
Solution Approach 1:
The flexible substrate provides locally optimized thermal management by embedding the die within thermally conductive layers and allowing passive components to be positioned on the flexible substrate away from the die, creating localized thermal zones that manage heat effectively while maintaining high I/O density.
3Reliability
If additional processing is performed at wafer level or panel level, then manufacturing yield is improved, but processing cost increases
Solution Approach 1:
The patent combines die embedding with the flexible substrate manufacturing process, performing both operations in a single integrated workflow rather than as separate steps. This merging maintains manufacturing yield while reducing the cumulative cost of multiple processing stages.
4Reliability
If through silicon vias are used for interconnection, then electrical connection reliability is improved, but package thickness increases
Solution Approach 1:
The patent extracts and eliminates the through silicon via structure from the design, replacing it with alternative interconnection methods that achieve electrical connectivity without requiring deep vertical vias through the die, thereby reducing package thickness while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a thin package thickness of less than 100 μm, improved thermal and electrical performance, and reduced manufacturing costs, enabling high power and reliability applications such as automotive and data center electronics without the need for through silicon vias.
Implementation Method 1
a semiconductor die attached by an adhesive to the flexible substrate
Implementation Method 2
A dielectric bonding film is laminated onto the flexible substrate and the semiconductor die and cured to seal the semiconductor die to the flexible substrate
Data Source
AI summary
A flexible substrate embedded die package is described comprising a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate, a semiconductor die attached by an adhesive to the flexible substrate and a dielectric bonding film surrounding the semiconductor die and sealing the semiconductor die to the flexible substrate.