Flexible Film Peripheral Structure for Narrow Bezel Display
Solution Overview
Problem
Existing display devices face limitations in reducing the bezel width due to the presence of various wirings, driving units, and sealants in the peripheral area, which can lead to light leakage and transmittance issues when trying to minimize the bezel size.
Innovation Solution
A display device design featuring a flexible film in the peripheral area, a thin film transistor with a top gate structure, and a flipped panel configuration, where the gate wiring layer covers the flexible film, and a light blocking film is used to prevent light from affecting the semiconductor layer, maintaining transistor characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the width of the peripheral area is decreased to reduce bezel width, then the design becomes more sleek and compact, but various wirings, driving units, and sealants cannot be properly attached
Solution Approach 1:
The flexible film is positioned in the peripheral area to create a stepped structure, allowing wirings and sealants to be attached on this elevated peripheral surface rather than directly on the substrate. This dimensional change provides adequate space for component attachment while maintaining a reduced overall bezel width.
Solution Approach 2:
The display panel is divided into a display area and a peripheral area, with the flexible film creating a distinct peripheral region. This segmentation allows the peripheral components (wirings, sealants) to be attached in the peripheral area without interfering with the display area, enabling reduced bezel width while maintaining manufacturability.
2Length of stationary object
If the peripheral area is minimized to reduce bezel width, then the display device becomes more compact, but light leakage and transmittance issues occur
Solution Approach 1:
The flexible film is applied specifically in the peripheral area rather than uniformly across the entire panel. This localized application provides light blocking where needed (at the periphery) while maintaining transparency in the display area, thus preventing light leakage without compromising overall transmittance.
Solution Approach 2:
The flexible film acts as an intermediary element between the substrate and the peripheral components. It provides a functional barrier that prevents light leakage at the periphery while allowing the display area to maintain its optical properties, thus mediating between the conflicting requirements of compactness and light control.
3Reliability
If the gate wiring is extended to the peripheral area to cover the flexible film, then the wiring connection is maintained, but the gate wiring may disconnect at the stepped portion
Solution Approach 1:
The interlayer insulating layer serves as an intermediary that fills the stepped portion created by the flexible film. This intermediary structure provides a smooth transition path for the gate wiring, allowing it to extend over the flexible film without being subjected to stress concentrations that would cause disconnection.
Solution Approach 2:
The interlayer insulating layer is formed beforehand to fill and smooth the stepped portion before the gate wiring is deposited. This prior cushioning of the structural discontinuity prevents wiring disconnection by eliminating the stress concentration point at the stepped portion.
Data Source
AI summary
A display device includes: a first display panel including a display area and a peripheral area, a flexible film disposed in the peripheral area, a thin film transistor disposed on the display area while being adjacent to the flexible film, a second display panel facing the first display panel and a sealant disposed in the peripheral area of the first display panel to attach the first display panel and the second display panel, and the first display panel includes: a substrate, a data wiring layer disposed on the substrate and in contact with a side end of the flexible film, a semiconductor layer disposed on the data wiring layer, an interlayer insulating layer disposed on the semiconductor layer and a gate wiring layer disposed on the interlayer insulating layer.